Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module

A refrigeration module and solid-state fan technology, which is applied in refrigeration and liquefaction, refrigerators, household refrigeration devices, etc., can solve the problems of complex overall structure, noise, vibration power consumption and energy consumption, etc., to overcome excessive volume and weight, overcome Effects of vibration and noise, low efficiency, and increased degree of freedom

Inactive Publication Date: 2016-01-27
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned semiconductor refrigerator uses water as a refrigerant for heat exchange, and a water pump is installed. The overall

Method used

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  • Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module
  • Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module
  • Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as Figure 1~3 As shown, the refrigerator of this embodiment includes: a box body 1 , a box door 2 , a semiconductor refrigeration module installed on the side wall of the box body 1 facing the box door 2 , a rectifier power supply 7 and an enclosure 8 .

[0039] The semiconductor refrigeration module includes: a semiconductor refrigeration sheet 5 and a cold-end radiator 3 and a hot-end radiator 4 respectively installed on the hot end surface and the cold end surface of the semiconductor refrigeration sheet 5, and the cold-end radiator 3 and the hot-end radiator 4 are all solid-state radiators. fan. The rectified power supply 7 supplies power to the semiconductor cooling chip 5 , the cold end radiator 3 and the hot end radiator 4 respectively through the wire 6 . The semiconductor cooling chip 5 of this embodiment adopts a single-stage thermopile structure.

[0040] The solid-state fan includes a collector plate and a linear discharge electrode 9 that cooperate ...

Embodiment 2

[0043] Such as Figure 4 As shown, in this embodiment, except that the structure of the discharge electrode is different from that of Embodiment 1, the rest of the structure is the same as that of Embodiment 1. The discharge electrode in this embodiment adopts the needle-shaped discharge electrode 12, and the needle-shaped discharge electrode 12 is located in the ion wind. The upper part of the channel 16 is distributed along the length direction of the ion wind channel 16 and the needles face the ion wind channel 16 . The needle-shaped discharge electrodes 12 are metal needles or metal pricking needles.

Embodiment 3

[0045] Such as Figure 5 As shown, the structure of this embodiment is the same as that of Embodiment 2 except for the structure of the discharge electrode. In this embodiment, the needle-shaped discharge electrode 12 is located at the end of the ion wind channel 16 and the needle head is facing the ion wind channel 16. All needle-shaped The discharge electrodes 12 are located on the same side of the collector plate and the needles are facing the same direction. Through the above arrangement, the ionic wind flowing in from one side of the metal fin plate as shown by the arrow in the figure and flowing out from the other side can dissipate heat to the hot and cold ends of the semiconductor refrigeration sheet.

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Abstract

The invention discloses a semiconductor refrigerating module provided with solid-state fans. The semiconductor refrigerating module comprises semiconductor refrigerating pieces and heat dissipation assemblies. The hot end faces and the cold end faces of the semiconductor refrigerating pieces are provided with the heat dissipation assemblies respectively. At least one heat dissipation assembly is provided with the solid-state fan. The invention further discloses a refrigerating container comprising the semiconductor refrigerating module. According to the semiconductor refrigerating module provided with the solid-state fans and the refrigerating container comprising the semiconductor refrigerating module, the solid-state fans are based on the corona discharge principle, mechanical movement components are omitted, and vibration and noise caused by a mechanical fan are avoided; meanwhile, the solid-state fans are low in working current and low in power consumption, heat dissipation fin plates can be utilized directly to serve as collector electrodes, and therefore the overall size and weight of a heat dissipation system are greatly reduced; in addition, the air speed can be changed by changing the voltage applied to discharge electrodes, the distance between the discharge electrodes and an electrode plate, and the distance between the discharge electrodes. The semiconductor refrigerating module provided with the solid-state fans and the refrigerating container comprising the semiconductor refrigerating module have the advantages that the structure is more compact and lighter, the operation process is free of vibration and noise, the efficiency is higher, the air speed is easy to control, and design and optimization can be conducted with higher degree of freedom according to requirements.

Description

technical field [0001] The invention relates to the technical field of refrigeration, in particular to a semiconductor refrigeration module with a solid-state fan and a refrigerator including the module. Background technique [0002] In order to reduce the vibration and noise caused by mechanical pumps, valves and other structures in the refrigeration process, more and more researches have been carried out on refrigeration devices without valves and mechanical pumps. Ammonia diffusion absorption refrigerator is a ternary working fluid absorption refrigerator, which uses liquid evaporation to achieve continuous refrigeration. The ammonia water diffusion absorption refrigerator uses ammonia as the refrigerant, water as the absorbent, and auxiliary inert gas as the diffusing agent. Function, so that the whole system does not need to be equipped with valves, and at the same time, the principle of thermosiphon is used to enable the refrigeration system to run in a cycle, without...

Claims

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Application Information

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IPC IPC(8): F25D11/00F25B21/02
Inventor 何一坚李荣陈泽鹏蒋云云
Owner ZHEJIANG UNIV
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