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Heat-resistant hot melt adhesive film suitable for round wire conductor FFC wire material

A hot-melt adhesive and insulating film technology, applied in the direction of adhesives, film/sheet adhesives, adhesive additives, etc. Quality and service life, reduced manufacturing cost, good glue flow effect

Inactive Publication Date: 2018-09-04
广东莱尔新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the field of FFC, more and more customers choose to use round wire conductors to make products. Compared with flat conductors, products made of round wire conductors have better signal transmission and lower dielectric loss; Hot melt adhesive film has higher requirements
The common 105°C hot melt adhesive on the market is applied to the round conductor FFC wire, which has insufficient heat resistance, and the amount of overflow glue at the root of the wire at the window position of the finished FFC wire is too large, resulting in copper leakage after the conductor is gold-plated. The glue of the connector will not overflow to the surface of the conductor in an environment of 85°C; if the heat resistance of the hot melt adhesive film is improved by increasing the specific gravity of the curing agent, the fluidity of the hot melt adhesive will be reduced. After the film is attached to the round wire conductor, the round wire conductor cannot be filled with glue, and holes will be formed, which will affect the quality of the wire

Method used

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  • Heat-resistant hot melt adhesive film suitable for round wire conductor FFC wire material
  • Heat-resistant hot melt adhesive film suitable for round wire conductor FFC wire material
  • Heat-resistant hot melt adhesive film suitable for round wire conductor FFC wire material

Examples

Experimental program
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Effect test

Embodiment 1

[0023] A hot-melt adhesive made of various raw materials in the following percentages by weight:

[0024]

[0025] Wherein, the glass transition temperature of the saturated polyester resin A is 0-20°C, the softening point is 140-160°C, the hydroxyl value is 15-25, and the acid value is less than 3; the glass transition temperature of the saturated polyester resin B is 5~20℃, the softening point is 100~120℃, the hydroxyl value is less than 3, and the acid value is less than 3; the glass transition temperature of saturated polyester resin C is 50~70℃, the softening point is 115~135℃, and the hydroxyl value is less than 6 , the acid value is less than 3.

[0026] A heat-resistant hot-melt adhesive film suitable for round wire conductor FFC wire made by applying the above-mentioned hot-melt adhesive, which sequentially includes: an insulating film layer, a pre-coat layer and an adhesive film made of the melt adhesive. binder layer. Wherein the thickness of the insulating fil...

Embodiment 2

[0028] A hot-melt adhesive made of various raw materials in the following percentages by weight:

[0029]

[0030] Wherein, the glass transition temperature of the saturated polyester resin A is 0-20°C, the softening point is 140-160°C, the hydroxyl value is 15-25, and the acid value is less than 3; the glass transition temperature of the saturated polyester resin B is 5~20℃, the softening point is 100~120℃, the hydroxyl value is less than 3, and the acid value is less than 3; the glass transition temperature of saturated polyester resin C is 50~70℃, the softening point is 115~135℃, and the hydroxyl value is less than 6 , the acid value is less than 3.

[0031] A heat-resistant hot-melt adhesive film suitable for round wire conductor FFC wire made by applying the above-mentioned hot-melt adhesive, which sequentially includes: an insulating film layer, a pre-coat layer and an adhesive film made of the melt adhesive. binder layer. Wherein the thickness of the insulating fil...

Embodiment 3

[0033] A hot-melt adhesive made of various raw materials in the following percentages by weight:

[0034]

[0035] Wherein, the glass transition temperature of the saturated polyester resin A is 0-20°C, the softening point is 140-160°C, the hydroxyl value is 15-25, and the acid value is less than 3; the glass transition temperature of the saturated polyester resin B is 5~20℃, the softening point is 100~120℃, the hydroxyl value is less than 3, and the acid value is less than 3; the glass transition temperature of saturated polyester resin C is 50~70℃, the softening point is 115~135℃, and the hydroxyl value is less than 6 , the acid value is less than 3.

[0036] A heat-resistant hot-melt adhesive film suitable for round wire conductor FFC wire made by applying the above-mentioned hot-melt adhesive, which sequentially includes: an insulating film layer, a pre-coat layer and an adhesive film made of the melt adhesive. binder layer. Wherein the thickness of the insulating fil...

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Abstract

The invention relates to the field of electronic equipment, in particular to a hot melt adhesive. The hot melt adhesive is prepared from the following raw materials in percentage by weight: 13.5 to 22.5 percent of saturated polyester resin A, 9 to 20.5 percent of saturated polyester resin B, 11 to 13.5 percent of saturated polyester resin C, 40 to 45 percent of a flame retardant, 0.2 to 1.0 percent of a curing agent and 9 to 14.8 percent of the balance, wherein the hydroxyl value of the saturated polyester resin A is 15 to 25 and the acid value of the saturated polyester resin A is less than 3; the hydroxyl value of the saturated polyester resin B is less than 3 and the acid value of the saturated polyester resin B is less than 3; the hydroxyl value of the saturated polyester resin C is less than 6 and the acid value of the saturated polyester resin C is less than 3. A hot melt adhesive film is made of the hot melt adhesive; after a round wire conductor is pressed by the hot melt adhesive film the adhesive overflowing quantity at the root part of the conductor at the window position is extremely low; occlusion connector glue does not overflow to the surface of the conductor, the glue has high flowability, and no hole is formed, so that while the manufacturing cost is reduced, the quality of products is greatly improved and the service life of the products is greatly prolonged.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a hot-melt adhesive and a heat-resistant hot-melt adhesive film applied thereto and suitable for round conductor FFC wires. Background technique [0002] Flexible Flat Cable (FFC, the English full name is: Flexible Flat Cable) is a new type of data cable that is made of PET insulating material and extremely thin tinned flat copper wire through a high-tech automatic equipment production line. It has the advantages of bending and folding, thin thickness, small size, simple connection, convenient disassembly, and easy to solve electromagnetic shielding. The existing FFC insulating film structure is a three-layer structure, which is a PET (polyethylene terephthalate chemical formula: (ClOH804)n) film layer, a pre-coated ink layer and a conventional hot-melt adhesive layer. It utilizes PET film to form integrally with conventional flat FFC cable hot melt adhesive on coating equipm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/00C09J11/04C09J11/06C09J7/30
CPCC08K2003/2241C08L2201/08C08L2205/025C08L2205/03C09J7/30C09J11/04C09J11/06C09J167/00C09J2301/122C09J2301/304C08L67/00C08K13/02C08K5/136C08K5/29C08K3/22C08K5/523
Inventor 李政叶海南曾永健
Owner 广东莱尔新材料科技股份有限公司