Material filling device

Abstract

The invention relates to a material filling device. The material filling device comprises a to-be-filled container, a material conveying pipeline system, a vacuum pipeline system, a tail gas pipelinesystem and a nitrogen pipeline system. A material source and the container are connected through the material conveying pipeline system. The tail gas pipeline system, the vacuum pipeline system and the nitrogen pipeline system communicates with the material conveying pipeline system and the container. The material conveying pipeline system comprises a material conveying pipeline and a first valvearranged on the material conveying pipeline. The material inlet end of the material conveying pipeline is connected to the material source. The material outlet end of the material conveying pipeline is connected to a material inlet of the container. A control device is connected with the first valve and controls opening and closing of the first valve. By adoption of the material filling device, material filling work can be conducted in an ordinary environment, a safe gas atmosphere is provided for material filling, and safe material filling is achieved; and limitations from auxiliary devices such as a glove box are avoided, and operation is convenient, fast and safe.

Description

technical field [0001] The invention relates to a material filling device, which belongs to the technical field of chemical equipment. Background technique [0002] MO sources are high-purity metal-organic compounds, which are support materials for epitaxial growth using metal-organic chemical vapor deposition (MOCVD), such as GaAs, GaN, InP, AlGaAs and other compound semiconductor ultra-thin film materials, which can be used to produce LED epitaxy Chips, HEMT devices, semiconductor lasers, solar cells, etc.; it is one of the key materials for the development of the optoelectronics industry, and is also an essential raw material for the production of high-brightness, ultra-high-brightness luminescent materials and large-scale integrated circuits. The MO source has very active chemical properties and is extremely sensitive to air and water vapor. It will spontaneously ignite instantly in the air, and explode violently when it meets water. Therefore, the filling of the MO sou...

AI Technical Summary

Problems solved by technology

During the filling process, due to the extremely volatile characteristics of some types of MO sources, it is easy to fill the glove box with gaseous MO sources, which causes a large amount of adsorbates (such as organic solvent adsorption columns) in the glove box to be consumed , requiring frequent replacement

[0004] With the rapid development of the market economy and the increasing application of electronic technology, the market demand for MO sources has increased significantly, and the specifications of steel cylinders used for filling MO sources have also been continuously enlarged, from the initial 500g and 1000g to 8kg, 16kg, or even larger, because the steel cylinder after filling is heavy, the steel cylinder is easy to slip and damage the glove box during the process of manually moving the steel cylinder, which may cause the MO source to burn, which makes the pure manual operation in the glove box It becomes more difficult and there is a greater security risk

[0005] It can be seen that the traditional manual filling method has been difficult to meet the demand

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