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MEMS (Micro-electromechanical System) device and production method thereof

A manufacturing method and device technology, applied in chemical instruments and methods, separation methods, instruments, etc., can solve the problems of high cost and complicated MEMS device manufacturing process, and achieve the effect of reducing production cost and simplifying manufacturing process.

Inactive Publication Date: 2018-09-14
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the manufacturing process of MEMS devices is complicated and the cost is high

Method used

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  • MEMS (Micro-electromechanical System) device and production method thereof
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  • MEMS (Micro-electromechanical System) device and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Refer below Figure 2A-Figure 2E ,in Figures 2A-2D is a schematic cross-sectional view of a device respectively obtained by sequentially implementing the steps of the method according to Exemplary Embodiment 1 of the present invention. Figure 2E is a schematic top view of the device obtained by the method according to Exemplary Embodiment 1 of the present invention.

[0067] The invention provides a method for preparing a MEMS device, such as Figure 6 As shown, the main steps of the preparation method include:

[0068] Step S601: providing a MEMS wafer;

[0069] Step S602: forming a filter layer on the front surface of the MEMS wafer;

[0070] Step S603: forming several filter holes in the filter layer;

[0071] Step S604: etching the MEMS wafer through the filter hole to form a groove in the MEMS wafer below the filter hole;

[0072] Step S605: Thinning the MEMS wafer on the back side to expose the filter holes.

[0073] In the following, specific implementat...

Embodiment 2

[0090] Refer below Figure 3A-Figure 3E ,in Figure 3A-3D It is a schematic cross-sectional view of devices respectively obtained by sequentially implementing the steps of the method according to the second exemplary embodiment of the present invention. Figure 3E is a schematic top view of the device obtained by the method according to the second exemplary embodiment of the present invention.

[0091] First, execute step S601, such as Figure 3A As shown, a MEMS wafer 300 is provided.

[0092] Exemplarily, the MEMS wafer 300 may be at least one of the materials mentioned below: single crystal silicon, silicon-on-insulator (SOI), silicon-on-insulator (SSOI), silicon-germanium-on-insulator ( S-SiGeOI), silicon germanium on insulator (SiGeOI) and germanium on insulator (GeOI), etc.

[0093] As the size of the filter screen increases, the filter screen structure made according to the method of Embodiment 1 is prone to damage and the reliability is reduced. In order to further...

Embodiment 3

[0108] Refer below Figure 4A-Figure 4F ,in Figures 4A-4E It is a schematic cross-sectional view of devices respectively obtained by sequentially implementing the steps of the method according to the third exemplary embodiment of the present invention. Figure 4F is a schematic top view of the device obtained by the method according to the third exemplary embodiment of the present invention.

[0109] First, execute step S601, such as Figure 4A As shown, a MEMS wafer 400 is provided.

[0110] Exemplarily, the MEMS wafer 400 may be at least one of the materials mentioned below: single crystal silicon, silicon-on-insulator (SOI), silicon-on-insulator (SSOI), silicon-germanium-on-insulator ( S-SiGeOI), silicon germanium on insulator (SiGeOI) and germanium on insulator (GeOI), etc.

[0111] Next, execute step S602, such as Figure 4A As shown, a filter layer 402 is formed on the front side of the MEMS wafer 200 . The filter layer 402 includes a polyimide layer.

[0112] Ex...

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Abstract

The invention provides an MEMS (Micro-electromechanical System) device and a production method thereof. The method comprises the steps of providing an MEMS wafer; forming a filter layer on the front surface of the MEMS wafer; forming a plurality of filter holes in the filter layer; etching the MEMS wafer through the filter holes, thereby forming a groove in the MEMS wafer under the filter holes; and thinning the MEMS wafer from the back, thereby exposing the filter holes. According to the production method of the MEMS device provided by the invention, the filter layer is formed on the front surface of the MEMS wafer, the plurality of filter holes are formed in the filter layer, the MEMS wafer is etched through the filter holes to form the groove in the MEMS wafer, and the MEMS wafer is thinned from the back to expose the filter holes of the filter layer. According to the method, the production technology of the MEMS device can be effectively reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MEMS device and a manufacturing method thereof. Background technique [0002] In the field of electronic consumption, multi-function devices are more and more popular among consumers. Compared with devices with simple functions, the production process of multi-function devices will be more complicated, such as the need to integrate multiple chips with different functions on the circuit board, so 3D integrated circuit (integrated circuit, IC) technology. Among them, Micro-electromechanical System (MEMS) has obvious advantages in terms of volume, power consumption, weight and price. So far, a variety of different sensors have been developed, such as acoustic sensors, pressure sensors, inertial sensors and other sensors. [0003] At present, the manufacturing process of MEMS devices is complicated and the cost is high. Therefore, it is necessary to propose a new method f...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81B1/00
CPCB81C1/00087B81B1/004B81C1/00103
Inventor 程晋广陈福成
Owner SEMICON MFG INT (SHANGHAI) CORP