A kind of encapsulation structure and encapsulation method of oled device

Abstract

The encapsulation structure and encapsulation method of the OLED device provided by the present invention improve the water and oxygen barrier performance of the OLED device by arranging the organic layer between the first organic reinforcement layer and the second organic reinforcement layer; and the first organic reinforcement layer and the second organic reinforcement layer Both the second organic reinforcement layers include organic fluoride, which is chemically bonded to silicon dioxide, so that the organic-inorganic interfacial bonding is better than simple physical stacking, thereby improving the service life of the OLED device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure and a packaging method of an OLED device. Background technique [0002] OLED (Organic Lighting Emitting Diode, Organic Light Emitting Diode) devices have received widespread attention due to their advantages such as self-illumination, rich colors, fast response speed, wide viewing angle, and light weight. However, organic materials in OLED devices are easily corroded by water and oxygen, resulting in reduced device life. Therefore, effective packaging and transformation of OLED devices has become a research hotspot in the field of OLED packaging. [0003] Usually, thin-film packaging adopts the structure of multi-layer film stacking to improve the water-oxygen barrier ability, and there will be a thicker organic layer in the multi-layer film as a stress buffer and foreign matter coating layer, but the water-oxygen barrier capacity of the organic layer Comp...

AI Technical Summary

Problems solved by technology

However, organic materials in OLED devices are easily corroded by water and oxygen, resulting in reduced device life. Therefore, effective packaging and transformation of OLED devices has become a research hotspot in the field of OLED packaging.

[0003] Usually, thin-film packaging adopts the structure of multi-layer film stacking to improve the water-oxygen barrier ability, and there will be a thicker organic layer in the multi-layer film as a stress buffer and foreign matter coating layer, but the water-oxygen barrier capacity of the organic layer Compared with the inorganic layer, the protection of the organic layer has attracted more and more attention from researchers.

[0004] At present, organic materials in OLED devices are still a major problem that reduces the service life of devices. Under the premise that some organic materials cannot be replaced by inorganic materials, the protection of organic materials is particularly important.

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