A chemical vapor deposition furnace
A chemical vapor deposition, deposition chamber technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of difficult to effectively control the intake and exhaust, uneven film thickness, uneven heating, etc. To achieve the effect of being suitable for popularization and use, the thickness of the film is consistent, and the distribution of gas is uniform.
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Embodiment 1
[0026] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, a chemical vapor deposition furnace includes a furnace body 100, one side of the furnace body is provided with a furnace door 200, the other side of the furnace body is provided with a gas outlet hood 300, and the gas outlet hood is connected to the gas outlet pipe 1; one end of the furnace door is hinged to the furnace body, the furnace body is provided with an intake pipe 2, an intake baffle 3, a deflector assembly 4, and a deposition chamber 5 from left to right; the intake baffle is connected to the chamber wall of the furnace body, and the intake baffle is connected to the furnace body The direction of the horizontal central axis is vertical, the center of the air intake baffle is provided with a through hole 6, the air intake pipe passes through and is fixedly connected to the edge of the through hole, and the deflector assembly includes a symmetrically arranged upper deflector assembly 41, a lower T...
Embodiment 2
[0035] In this embodiment, a through hole may be provided at the lower part of the left chamber plate, and a through hole may be provided at the upper part of the right chamber plate. The positions of the through holes of the left chamber plate and the right chamber plate are arranged in a staggered manner, so that the airflow forms a return airflow in the settling chamber, prolonging the residence time of the airflow in the settling chamber.
[0036] In this embodiment, the middle room plate A and the middle room plate B, wherein the middle room plate A is close to the left room plate, the middle room plate B is close to the right room plate, the upper part of the middle room plate A is provided with a through hole, and the middle room plate B is The lower part is provided with a through hole.
[0037] The rest of the structure is consistent with that of Embodiment 1, and will not be repeated here.
Embodiment 3
[0039] Parameters of Example 1
[0040] Heating method: resistance heating; the heater is resistance heating;
[0041] Deposition chamber: made of graphite or carbon / carbon composite;
[0042] Ultimate vacuum degree of cold empty furnace: ≤30Pa;
[0043] Pressure rise rate: ≤0.08Pa / min;
[0044] Maximum operating temperature: 1500°C.
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Abstract
Description
Claims
Application Information
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