High-heat dissipation three-dimensional circuit board and manufacturing method thereof

A three-dimensional circuit, high heat dissipation technology, used in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of cumbersome production and assembly, unable to meet the needs of actual use, poor heat dissipation effect, etc., to achieve convenient and simple assembly, timely heat dissipation, strong installation effect

Pending Publication Date: 2018-09-25
CHANGZHOU XINGYU AUTOMOTIVE LIGHTING SYST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the currently adopted heat dissipation method has poor heat dissipation effect, cumbersome production and assembly, and cannot meet the needs of actual use for the car light source LED with high heat dissipation requirements, the present invention provides a high heat dissipation three-dimensional circuit board and a manufacturing method

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  • High-heat dissipation three-dimensional circuit board and manufacturing method thereof
  • High-heat dissipation three-dimensional circuit board and manufacturing method thereof
  • High-heat dissipation three-dimensional circuit board and manufacturing method thereof

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0026] Such as Figure 1 to Figure 2 As shown, a three-dimensional circuit board with high heat dissipation,

[0027] It includes a heat sink 1 and a plurality of LED patch components 2, and the heat sink 1 is a metal die-casting part or a metal forging part;

[0028] The outer surface of the radiator 1 is sprayed with a powder coating film layer;

[0029] A laser circuit graphic layer is arranged on the powder coating film layer of the heat sink 1;

[0030] A conductive connection layer is chemically plated on the laser circuit pattern layer and the rest of the outer surface of the radiator 1;

[0031] A plurality of LED patch components 2 are arranged on the conductive connection layer of the heat sink 1 .

[0032] A method for manufacturing a three-dimensional circuit board with high heat dissipation,

[0033] Step 1: Die-casting or forging radi...

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Abstract

The invention discloses a high-heat dissipation three-dimensional circuit board and a manufacturing method thereof and belongs to the technical field of automobile illumination. The circuit board comprises a heat radiator and multiple LED surface mounted components. The heat radiator is a metal die-casting piece or a metal forging piece. The outer surface of the heat radiator is coated with powderspraying coating film layer. A laser circuit graphic layer is arranged on the powder spraying coating film layer of the heat radiator. The laser circuit graphic layer and other outer surfaces of theheat radiator are chemically plated with conductive connection layers. The LED surface mounted components are installed on the conductive connection layers of the heat radiator. According to the invention, compared with the prior art, the LEDs directly contact with the heat radiator, so good heat dissipation effects are achieved; the three-dimensional circuit board is convenient and simple to assemble; the LEDs are firmly installed; heat is timely dissipated; and occurrence of light attenuation phenomena is avoided.

Description

technical field [0001] The invention belongs to the technical field of automobile lighting, and in particular relates to a three-dimensional circuit board with high heat dissipation and a manufacturing method. Background technique [0002] With the development of LED technology in recent years, LED has also been widely used in the field of car light source. There are many kinds of LEDs, which are divided into different powers and light colors. However, LED has a disadvantage during use, that is, after a period of lighting, as the temperature rises, light decay will occur. If the heat dissipation is not good, the light attenuation will be more serious, resulting in the light distribution of the lamps and lanterns not meeting the design requirements. In addition, the light source of each functional module of the car light is generally composed of multiple LEDs. Due to the requirements of the shape design, multiple LEDs are often not on the same plane. In this regard, two me...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/10H05K3/30
CPCH05K1/021H05K3/10H05K3/303H05K2201/10106
Inventor鲁力朱彩萍丁浩
OwnerCHANGZHOU XINGYU AUTOMOTIVE LIGHTING SYST