Thermal conductive adhesive spreading device for CPU hardware

Abstract

The invention discloses a thermal conductive adhesive spreading device for CPU hardware. The thermal conductive adhesive spreading device comprises a holding tank of which one end is connected to an extrusion mechanism, and the extrusion mechanism comprises an extrusion piston, a mounting barrel, a fixing plate and a driving device; the outer side of the extrusion piston is in sliding fit to the inner wall of the holding tank, and one side of the extrusion piston is fixed to the output end of the driving device fixed to the fixing plate; the fixing plate is fixed to the inner wall of the mounting barrel, and the outer side of one end of the mounting barrel is provided with external threads; and the end, close to the mounting barrel, of the holding tank is provided with internal threads, and the holding tank is movably connected to the mounting barrel through threads. According to the thermal conductive adhesive spreading device for the CPU hardware, thermal conductive adhesive can be spread on the surface of a CPU heat generation end, and the thickness of the thermal conductive adhesive is rational; the thicknesses of different areas are uniform, and hand fatigue caused by manual spreading by workers is avoided; and the thermal conductivity of the thermal conductive adhesive for a CPU is improved.

Description

technical field [0001] The invention relates to the technical field of computer applications, in particular to a cooling glue application device for computer CPU hardware. Background technique [0002] The CPU is a very large-scale integrated circuit, which is the computing core and control core of a computer. Its function is mainly to interpret computer instructions and process data in computer software. The central processing unit mainly includes an arithmetic unit, a high-speed cache memory, and a data, control, and status bus that realizes the connection between them. Together with internal memory and input / output devices, it is called the three core components of an electronic computer. [0003] When the CPU is running, the thermal power consumption ranges from a few W to hundreds of W. With such a large power in a small area, the heat is certain, and the CPU can only work stably at about 70-80 degrees, so the computer In order to make the CPU work more stably, the m...

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Problems solved by technology

[0003] When the CPU is running, the thermal power consumption ranges from a few W to hundreds of W. With such a large power in a small area, the heat is certain, and the CPU can only work stably at about 70-80 degrees, so the computer In order to make the CPU work more stably, the manufacturer needs to apply heat-dissipating glue on it. However, in the existing technology, the heat-dissipating glue applied to the CPU is mostly done manually, and some need to squeeze out the heat-dissipating glue in the bag, which makes it difficult to control the extrusion of the heat-dissipating glue. , and the ranking of thermal conductivity is as follows: metal (copper, aluminum)>silicon grease>air, so the heat dissipation glue does not need to be applied too much, just seal the gap between the two metal sheets. , but the thickness of the heat dissipation glue cannot be effectively controlled when manually applied, and the thickness of each area is uneven, which reduces the thermal conductivity of the heat dissipation glue to the CPU

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