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Encapsulation structure of organic light emitting diode and preparation method thereof

A technology of light-emitting diodes and packaging structures, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems affecting the life of OLED devices, high cost and technical investment, and increased voltage, so as to achieve flexible display, reduce Damage and stability improvement effect

Active Publication Date: 2020-01-03
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the focus of OLED development is gradually shifting to flexible display with more market potential, which puts forward higher requirements for packaging, so that the current common thin film encapsulation (Thin film encapsulation-TFE) has come into being. Thin film encapsulation generally uses There are inorganic / organic alternative methods, and compared with traditional glass encapsulation methods, the cost and technical investment will be higher
In addition, when the organic light-emitting material is irradiated by ultraviolet light, it will be damaged, which will increase the voltage and affect the life of the OLED device.

Method used

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  • Encapsulation structure of organic light emitting diode and preparation method thereof
  • Encapsulation structure of organic light emitting diode and preparation method thereof
  • Encapsulation structure of organic light emitting diode and preparation method thereof

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0018] see figure 1 , figure 1 It is a structural schematic diagram of the first embodiment of the package structure of the organic light emitting diode of the present application. like figure 1 As shown, the package structure A in the present application is formed on the substrate B. Wherein, the base B includes a substrate 10 , a pixel definition layer 12 disposed on the substrate 10 and a light emitting layer 11 disposed in an opening of the...

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Abstract

The present application discloses a packaging structure of an organic light emitting diode and a manufacturing method thereof. The packaging structure is formed on a substrate, and the substrate includes a substrate, a pixel definition layer arranged on the substrate, and a pixel definition layer arranged in the opening of the pixel definition layer. The light-emitting layer includes an organic light-emitting diode. The encapsulation structure includes an ultraviolet absorbing layer that at least covers the light-emitting layer. The ultraviolet absorbing layer includes organic monomers that modify the surface of titanium dioxide particles. Through the above method, the present application can effectively reduce the damage of the organic light emitting diode device by external ultraviolet light, and improve the stability of the flexible display of the organic light emitting diode.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a packaging structure of an organic light emitting diode and a preparation method thereof. Background technique [0002] Organic Light-Emitting Diode (OLED), as a new generation display technology, has received extensive attention because it can be made thinner and can realize flexible display. One of the important factors currently restricting flexible display is packaging technology. OLED uses small molecules or macromolecules to apply voltage through the anode and cathode to form electroluminescence. These luminescent materials are easily cracked in the presence of water or oxygen, so OLED Or organic solar cells require a passivation layer to protect the materials used in the device. In particular, for OLED devices, the water and oxygen transmission rate of the passivation layer (barrier layer) is required to reach 10-6g / m2d. [0003] At present, the focus of OLED...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/84H10K71/00
Inventor 金江江徐湘伦
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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