Burning treatment device of waste gas in semiconductor manufacturing process

A processing device and semiconductor technology, applied in the direction of gas treatment, combustion method, combined device, etc., can solve the problem of incomplete combustion of waste gas

Pending Publication Date: 2018-10-12
安徽京仪自动化装备技术有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a combustion treatment device for semiconductor process waste gas, which solves the problem of incomplete combustion of semiconductor process waste gas

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Burning treatment device of waste gas in semiconductor manufacturing process
  • Burning treatment device of waste gas in semiconductor manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] Such as Figure 1-2 As shown, the embodiment of the present invention provides a combustion treatment device for semiconductor process waste gas, including a dust removal box 1, the left side of the dust removal box 1 is connected to an air inlet pipe 3, and the air inlet pipe 3 is provided with a first fan 2, and the inside of the dust removal box 1 is fixed. The first filter screen 4 is installed, the first nozzle 5 is fixedly installed at the bottom ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a burning treatment device of waste gas in the semiconductor manufacturing process and relates to the technical field of industrial environment-friendly equipment. The burning treatment device of the waste gas in the semiconductor manufacturing process comprises a dust removing box, wherein a gas inlet pipe is communicated with the left side of the dust removing box; a firstfan is arranged on the gas inlet pipe; a second fan is communicated with the top part of the dust removing box; a dryer is arranged on a first gas inlet pipe; a burning box is communicated with the right end of the first gas inlet pipe; a ceramic heat-transferring plate is fixedly connected with the interior of the burning box; a third fan is communicated with the left side of the burning box; aliquefied-gas box body is fixedly arranged at the top part of the burning box; a gas outlet pipe is communicated with the right side of the burning box. The burning treatment device of the waste gas in the semiconductor manufacturing process provided by the invention has the beneficial effects that by arrangement of the dust removing box, the gas can pass the device more smoothly; by arrangement of the device box, the acid-base neutralization is carried out on the primarily-filtered gas; by arrangement of the burning box, fully-burnt gas can enter the atmosphere through a gas outlet.

Description

technical field [0001] The invention relates to the technical field of industrial environmental protection equipment, in particular to a combustion treatment device for semiconductor process waste gas. Background technique [0002] With the progress of society, the process of industrialization is also developing rapidly. The continuous development of industrial production will discharge a large amount of industrial residual gas into the atmosphere. Such gas discharge into the atmosphere will lead to many serious consequences, such as: environmental pollution. The factory building, especially the modern steel structure factory building, has a great corrosion effect, causing irreparable losses and affecting the surface quality of finished products and re-products, especially acid gas can cause corrosion on the surface of copper and copper alloy strips , rust spots, and acid-base waste gas is also very harmful to human health, semiconductor waste gas emission is no exception, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B01D50/00B01D53/75B01D53/26B01D53/40B01D53/42F23G7/06
CPCB01D53/26B01D53/40B01D53/42B01D53/75F23G7/06F23G2209/14B01D2258/0216B01D50/60
Inventor 杨春水曹小康司马超张坤赵力行邹昭平蒋俊海于浩
Owner 安徽京仪自动化装备技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap