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Phenolic resin adhesive

A phenolic resin glue and adhesive technology, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., to achieve the effect of increasing the dosage, reducing the amount of phenol and improving the performance.

Inactive Publication Date: 2018-10-16
ZIBO SRING ADHESIVE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The proportioning ratio of this phenolic resin adhesive has not yet been seen in the report of scientific and technological literature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0013] The phenolic resin adhesive is prepared from the following raw materials in proportion by weight: 31% phenol, 69% 36% formaldehyde solution, and 0.3% plasticizer.

[0014] Add metered phenol, formaldehyde and plasticizer to a 500mL three-necked flask equipped with a spherical condenser, a thermometer and a stirring device, and use Ba(OH) 2 Adjust the pH to >8. Stir and heat up to 40°C. After the catalyst, plasticizer and phenol are completely dissolved, slowly heat up to the required reaction temperature. React at a certain temperature until the water solubility of the resin (water solubility refers to the number of milliliters of water required when adding water to 1g of resin at 20°C until it becomes turbid) is 1:1, then stop the reaction. Cool down to 60°C, remove water under a vacuum of 0.9Pa, so that the solid content reaches 70%, and obtain a reddish-brown transparent liquid with a viscosity of about 0.5Pa·s (20°C).

example 2

[0016] The phenolic resin adhesive is prepared from the following raw materials in proportion by weight: 36% phenol, 65% 36% formaldehyde solution, and 0.3% plasticizer.

[0017] Add metered phenol, formaldehyde and plasticizer to a 500mL three-necked flask equipped with a spherical condenser, a thermometer and a stirring device, and use Ba(OH) 2 Adjust the pH to >8. Stir and heat up to 40°C. After the catalyst, plasticizer and phenol are completely dissolved, slowly heat up to the required reaction temperature. React at a certain temperature until the water solubility of the resin (water solubility refers to the number of milliliters of water required when adding water to 1g of resin at 20°C until it becomes turbid) is 1:1, then stop the reaction. Cool down to 60°C, remove water under a vacuum of 0.9Pa, so that the solid content reaches 70%, and obtain a reddish-brown transparent liquid with a viscosity of about 0.5Pa·s (20°C).

example 3

[0019] The phenolic resin adhesive is prepared from the following raw materials in proportion by weight: 35% phenol, 65% 36% formaldehyde solution, and 0.3% plasticizer.

[0020] Add metered phenol, formaldehyde and plasticizer to a 500mL three-necked flask equipped with a spherical condenser, a thermometer and a stirring device, and use Ba(OH) 2 Adjust the pH to >8. Stir and heat up to 40°C. After the catalyst, plasticizer and phenol are completely dissolved, slowly heat up to the required reaction temperature. React at a certain temperature until the water solubility of the resin (water solubility refers to the number of milliliters of water required when adding water to 1g of resin at 20°C until it becomes turbid) is 1:1, then stop the reaction. Cool down to 60°C, remove water under a vacuum of 0.9Pa, so that the solid content reaches 70%, and obtain a reddish-brown transparent liquid with a viscosity of about 0.5Pa·s (20°C).

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PUM

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Abstract

The invention provides a phenolic resin adhesive. The phenolic resin adhesive of the invention is water-soluble resin and has short curing time, low phenol content and good usage performance. A preparation method for the phenolic resin adhesive is characterized by comprising the following steps: adding metered phenol, formaldehyde and a plasticizer into a 500-mL three-necked flask equipped with aspherical condenser, a thermometer and a stirring device, adjusting a pH value to 8 by using Ba(OH)2, carrying out stirring and heating to 40 DEG C, and after a catalyst, the plasticizer, phenol and the like are dissolved completely, carrying out slow heating to a desired reaction temperature; carrying out a reaction at a certain temperature until the water-solubility of resin is 1: 1 (wherein water-solubility refers to the amount, in term of ml, of water added into 1 g of resin at 20 DEG C to allow the resin to become turbid), and terminating the reactionat the time; carrying out cooling to 60 DEG C and removing water at a vacuum degree of 0.9 Pa to allow solid content to reach 70%, wherein reddish brown transparent liquid is obtained and has viscosity of about 0.5 Pa-s (20 DEG C).

Description

technical field [0001] The invention relates to a phenolic resin adhesive for abrasive belts and a preparation method thereof, belonging to the technical field of fine chemicals. Background technique [0002] The phenolic resin adhesive is formulated rationally with phenol, 36% formaldehyde solution, plasticizer, etc. as raw materials. [0003] Phenolic resin adhesive is a new product of adhesive. Its main features are: easy to obtain raw materials, simple process, short curing time, low phenol content, good performance, and can be used for bonding abrasive belts and related fields. [0004] Phenolic resin adhesive has the following characteristics: short curing time, low phenol content, and good performance. [0005] The proportioning ratio of the phenolic resin adhesive has not been reported in scientific and technological literature. Contents of the invention [0006] The technical problem to be solved in the present invention is to overcome the defects of the prior a...

Claims

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Application Information

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IPC IPC(8): C09J161/06C09J11/00C08G8/10
CPCC09J161/06C08G8/10C09J11/00
Inventor 刘士喜
Owner ZIBO SRING ADHESIVE CO LTD
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