Wire solder weld mark detection apparatus

Abstract

The invention discloses a wire solder weld mark detection apparatus for detecting the quality and the excellent rate of an IC (Integrated Circuit) board wire solder. The apparatus comprises a placement platform, a moving device, a working cavity and an image processor which are adjacent, the placement platform is provided with a placement base and an additional circuit board, the additional circuit board is provided with a plurality of grooves, an IC board can be placed in every groove, the moving device moves the additional circuit board to the working cavity or the image processor, the working cavity is provided with a fixed seat corresponding to the additional circuit board, the working cavity is provided with a water injection port, a reagent injection port, a wastewater recovery portand a waste reagent recovery port, and the image processor is used for detecting he IC boards. The apparatus is suitable for detecting a large number of IC chip detection places, avoids test personnelfrom being exposed to a high-risk working environment, and provides a safe, rapid and accurate detection effect.

Description

technical field [0001] The invention provides a welding line welding mark detection device, in particular, a welding line welding mark detection device for safe, fast and accurate detection of IC board welding marks and avoiding the exposure of operators to high-risk working places. Background technique [0002] At present, in the inspection of known IC (Integrated Circuit, integrated circuit) board manufacturing procedures, an important item is to remove and wash the wire between the die and the adhesive pad after wire bonding. and drying, and then put it under a high-magnification microscope for weld mark inspection to confirm the quality and excellent rate of the product. [0003] The related detection process of the welding wire usually takes about half an hour, and requires the use of corrosive strong acid solutions (such as aqua regia, nitric acid, sulfuric acid, etc.) or strong alkaline solutions (such as sodium hydroxide, hydrogen peroxide, etc.) for wire bonding Th...

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Problems solved by technology

[0003] The related detection process of the welding wire usually takes about half an hour, and requires the use of corrosive strong acid solutions (such as aqua regia, nitric acid, sulfuric acid, etc.) or strong alkaline solutions (such as sodium hydroxide, hydrogen peroxide, etc.) for wire bonding Therefore, when the above process is in progress, the operator will be directly exposed to the dangerous environment, which will cause certain risks in safety, and the corrosion process is man-made, which will inevitably lead to excessive use of corrosive liquid and difficulty Follow-up issues such as complete recycling, leading to environmental pollution or chemical reactions with other substances, resulting in toxic gases, etc.

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