A polysilicon slicing device

Abstract

The invention belongs to the technical field of production of polycrystalline silicon, and particularly relates to a polycrystalline silicon slicing device. The polycrystalline silicon slicing devicecomprises cutters, a cutting module, a blade grinding module and a chip removal module, wherein the cutters are fixed on the cutting module, the cutting module is used for realizing the movement of the cutters so as to perform slicing on the polycrystalline silicon, the blade grinding module is located above the cutting module, and is used for realizing blade grinding of the cutters so that the service life of the cutters can be prolonged and the cutting precision can be guaranteed, and the chip removal module is located inside the cutter, and is used for discharging chips near the cutter during the cutting process so that the movement of the cutter is facilitated and the effectiveness of cutting is improved. According to the polycrystalline silicon slicing device, so that a silicon waferis cut off through continuous cutting of the plurality of cutters, the impact force borne by the silicon wafer is small, the damage to the silicon wafer is small, meanwhile, blade grinding of the cutters can be achieved, and the service life of the cutters is prolonged.

Description

technical field [0001] The invention belongs to the technical field of polysilicon production, in particular to a polysilicon slicing device. Background technique [0002] Polycrystalline silicon is the main raw material for the manufacture of semiconductor devices and solar cells, and can also be used to prepare monocrystalline silicon. Its deep-processed products are widely used in the semiconductor industry as basic materials for devices such as artificial intelligence, automatic control, information processing, and photoelectric conversion. At the same time, due to the energy crisis and the call for a low-carbon economy, the world is actively developing and utilizing renewable energy. Solar energy has attracted the most attention among renewable energy sources due to its cleanness, safety, and abundant resources. One way to harness solar energy is by converting it into electricity through the photovoltaic effect. In the production process of silicon wafers, silicon waf...

AI Technical Summary

Problems solved by technology

Although this technical solution can achieve slicing of silicon wafers, the technical solution adopts a single cutting method with a single knife, which has high requirements for the tool, and in this solution, the tool cannot be sharpened, resulting in a short service life of the tool. , due to the large impact force on the silicon wafer, it is easy to cause the silicon wafer to break

Images