Etching method based on nickel-phosphorus alloy buried resistance copper foil

Abstract

The invention discloses an etching method based on a nickel-phosphorus alloy buried resistance copper foil, comprising the steps of: providing a nickel-phosphorus alloy buried resistance plate, laminating a film on the nickel-phosphorus alloy buried resistance plate, and forming a circuit pattern by exposure and development; etching away a copper layer and a nickel-phosphorus alloy buried resistance layer on the non-circuit pattern portion of the nickel-phosphorus alloy buried resistance plate by an acid etching process, and forming a circuit by retreating the film, wherein the time for etching the nickel-phosphorus alloy buried resistance layer is twice to three times the time for etching copper foil of the same thickness; according to the amount of side etching of the first board, compensating the circuit pattern and then executing mass production; applying a film to the nickel-phosphorus alloy buried resistance plate, and opening a window in the circuit at a joint corresponding to the nickel-phosphorus alloy buried resistance layer; etching away the copper layer at the window by an alkaline etching process, and then retreating the film. The method of the invention simplifies thecorresponding production process, improves the production efficiency, and prevents the copper layer in the circuit pattern from being seriously laterally eroded.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an etching method based on nickel-phosphorus alloy buried resistance copper foil. Background technique [0002] With the continuous improvement of the integration of electronic systems, PCB embedded resistance technology, as a method to replace surface resistor patches, can save the increasingly tight surface space of PCBA, and is also more reliable than chip resistors. [0003] Nickel-phosphorus alloy buried resistance copper foil refers to sputtering or electroplating a layer of nickel-phosphorus alloy on the copper foil, and forming a nickel-phosphorus alloy buried resistance plate by laminating the nickel-phosphorus alloy buried resistance copper foil with the dielectric layer, wherein the nickel-phosphorus alloy The buried resistance layer is located between the dielectric layer and the copper layer; a circuit with a buried resistance layer is made o...

AI Technical Summary

Problems solved by technology

[0004] In the above method, the circuit pattern needs to be made of alkaline etched copper foil and CuSO 4 +H 2 SO 4 Solution etching nickel-phosphorus alloy buried resistance layer consists of two etchings, plus alkaline etching of the buried resistance pattern, a total of three etchings, the process is more complicated, and the production efficiency is low