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Sintering method of electronic ceramic

A technology of electronic ceramics and sintering method, applied in the field of electronic ceramics production, can solve the problems of cracking, affecting the intact sintering of the green body, and small shrinkage.

Active Publication Date: 2018-11-06
HUNAN MEICHENG CERAMIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this stage, the green body has low strength after being heated and softened, and is prone to deformation, and the heating rate is directly controlled by the temperature; Higher pressure is generated, and various defects such as bubbling, swelling, cracking, delamination, and deformation of the green body will occur, which will not only reduce the yield of the entire process, but also further affect the perfect sintering of the green body
When the existing electronic ceramic product blanks are sintered, they are directly placed in the sagger. Since the lower surface of the product blank is in direct contact with the bottom surface of the sagger, there is friction between the product blank and the sagger. During the sintering process, the product blank needs to shrink. Due to friction, the lower part of the product blank shrinks less than the upper part, resulting in deformation of the formed product

Method used

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  • Sintering method of electronic ceramic
  • Sintering method of electronic ceramic
  • Sintering method of electronic ceramic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The first step: using dry pressing to form a mold, dipping, sanding and drying to obtain a dry electronic ceramic blank to be fired; use the same process to make a sintered gasket;

[0045] The second step: put the first step sintered gasket into the sagger, and place the blank to be sintered on the ceramic sintered gasket;

[0046] The third step: put the sagger obtained in the second step into the freezer, the temperature of the freezer is set at -10 to -5°C, the freezer drops at an average rate of -5°C per hour, and the freezing time is 2 to 3 hours;

[0047] Step 4: Put the sagger obtained in the third step into the high-pressure carbon dioxide preheating chamber to preheat quickly, the transfer time is 5-15 seconds, the preheating temperature is 75-90°C, the air pressure is 0.5-1MPa, and the preheating time is 10-10 30 minutes;

[0048] Step 5: Put the sagger obtained in Step 4 into a carbon dioxide heating furnace, heat it to 700-900°C at a rate of 100-300°C per ...

Embodiment 2

[0051] The first step: using dry pressing to form a mold, dipping, sanding and drying to obtain a dry electronic ceramic blank to be fired; use the same process to make a sintered gasket;

[0052] The second step: put the first step sintered gasket into the sagger, and place the blank to be sintered on the ceramic sintered gasket;

[0053] The third step: Put the sagger obtained in the second step into the freezer, the temperature of the freezer is set at -10 ~ ℃, the freezer drops at an average rate of -5°C per hour, and the freezing time is 2 hours;

[0054] Step 4: Put the sagger obtained in the third step into the high-pressure carbon dioxide preheating chamber to preheat quickly, the transfer time is 15 seconds, the preheating temperature is 75°C, the air pressure is 1MPa, and the preheating time is 20 minutes;

[0055] Step 5: Put the sagger obtained in Step 4 into a carbon dioxide heating furnace, heat it up to 900°C at a rate of 200°C per hour, and keep it warm for 1 t...

Embodiment 3

[0058] The first step: using dry pressing to form a mold, dipping, sanding and drying to obtain a dry electronic ceramic blank to be fired; use the same process to make a sintered gasket;

[0059] The second step: put the first step sintered gasket into the sagger, and place the blank to be sintered on the ceramic sintered gasket;

[0060] The third step: put the sagger obtained in the second step into the freezer, the temperature of the freezer is set to -5°C, the freezer drops at an average rate of -5°C per hour, and the freezer time is 3 hours;

[0061] Step 4: Put the sagger obtained in the third step into the high-pressure carbon dioxide preheating chamber to preheat quickly, the transfer time is 15 seconds, the preheating temperature is 90°C, the air pressure is 0.5MPa, and the preheating time is 30 minutes;

[0062] Step 5: Put the sagger obtained in Step 4 into a carbon dioxide heating furnace, heat it to 900°C at a rate of 300°C per hour, and keep it warm for 1 hour; ...

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Abstract

The invention discloses a sintering method of electronic ceramic. After a dry die casting forming blank is dried and frozen, the blank is stable, and after polyvinyl alcohol is heated, the solubilityis increased, the concentration is increased and the adhesive property is higher; the frozen blanks are heated and move towards the inner layer gradually, the outer layer is heated, water is lost fast, and the structure of the inner layer is in a stable state and performs a supporting effect; after the outer layer is heated and water is lost, the outer layer is hardened and small channels are formed, the inner layer is gradually heated, and the outer layer performs a supporting effect; pads with the same material and the same process are placed at the bottoms of the blanks when the blanks aresintered, and the small channel generated when the polyvinyl alcohol is eliminated is filled with an electronic ceramic material in the high-temperature sintering process, so that the blanks shrink when sintered, the blanks and the pads have the same material and the same process, the shrinkage rate is approximately the same, and displacement generated at the bottoms of the blanks and the upper surfaces of the pads is relatively small or can be ignored, so that deformation of the blanks caused by the fact that the blanks are in direct contact with a sagger to generate friction is avoided.

Description

technical field [0001] The invention relates to the field of electronic ceramics production, in particular to a sintering method of electronic ceramics. Background technique [0002] Dry die-casting of electronic ceramics generally requires the addition of volume ratio polyvinyl alcohol solution as a binder. Therefore, before sintering, the organic matter in the green body must be removed by heating, that is, preheated and volatilized. At this stage, the green body has low strength after being heated and softened, and is prone to deformation, and the heating rate is directly controlled by the temperature; When high pressure is generated, various defects such as bubbling, swelling, cracking, delamination, and deformation of the green body will occur, which will not only reduce the yield of the entire process, but also further affect the perfect sintering of the green body. When the existing electronic ceramic product blanks are sintered, they are directly placed in the sagge...

Claims

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Application Information

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IPC IPC(8): C04B35/622C04B35/626
CPCC04B35/622C04B35/62645C04B2235/6567C04B2235/6562Y02P40/60
Inventor 方豪杰贺亦文张晓云
Owner HUNAN MEICHENG CERAMIC TECH
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