Preparation method of on-chip high-quality thin film micro-optical structure

Abstract

The invention relates to a preparation method of an on-chip high-quality thin film micro-optical structure, comprising the steps of plating a metal layer on the surface of a thin film, carrying out femtosecond laser selective ablation on a metal film, carrying out chemical mechanical polishing and carrying out chemical corrosion. The on-chip micro-optical device prepared by adopting the method provided by the invention has extremely high surface finish and extremely low optical loss. The method is applicable to preparation of high-quality micro-optical structures (including but not limited toa micro disk cavity, a microring cavity, an optical waveguide and coupled devices thereof) on all kinds of on-chip thin films (including but not limited to a lithium niobate single crystal thin film,a quartz thin film, a silicon thin film, a silicon dioxide thin film, a diamond thin film and the like).

Description

technical field [0001] The invention relates to femtosecond laser processing and chemical mechanical polishing, in particular to a method for preparing on-chip microstructures (including microcavity discs, microrings, optical waveguides and their integrated structures) by using femtosecond laser processing combined with chemical mechanical polishing. This method is applicable to various on-chip thin film materials, including but not limited to lithium niobate single crystal thin film, quartz thin film, silicon thin film, silicon dioxide thin film, diamond thin film and the like. Background technique [0002] Micro-optical devices refer to micro-structured optical devices with a structure size above the submicron level and a surface roughness up to the nanometer level. On-chip micro-optical devices generally significantly increase the interaction between light and matter by localizing the light field in space and even in time. In basic research and engineering applications, s...

AI Technical Summary

Problems solved by technology

However, traditional chemical mechanical polishing is used to prepare flat material surfaces, rather than to improve the overall quality of on-chip thin film structures.

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