11 results about "Selective ablation" patented technology

The invention relates to the technical field of radio frequency integrated circuits and advanced semiconductor packaging, in particular to a radio frequency resistor calibration structure based on an RDL process and a manufacturing method, and the radio frequency resistor calibration structure comprises a main resistor module, a redundant resistor module, a laser fine tuning module, a shielding layer module and a temperature compensation module. The main resistor module is sputtered into a film through a low-temperature coefficient metal alloy, and the high-frequency skin effect is reduced by adopting a snakelike or interdigital geometric layout; and the redundant resistor module drives metal ions to migrate through a narrow-neck structure and an electromigration effect, and compensates photoetching line width deviation and uneven sputtering thickness. The laser fine tuning module adjusts a conductive path through selective ablation or annealing of pulse laser, and forms closed-loop calibration in combination with real-time feedback of the metal induction electrode. And the consistency regulation and control of radio frequency circuit parameters of a packaging level are realized.

The invention discloses a machining method for multi-stage laser composite modified auxiliary grinding, and belongs to the technical field of material machining. According to the method, a multi-step synergistic process of ultraviolet activation (cleaning / absorption increasing), infrared-induced loosening (oxidation channel construction / surface macroscopic removal difficulty reduction) and ultraviolet amorphous oxidation (brittle-plastic transition promotion / subsurface layer heat affected zone repair) is adopted, and selective ablation of infrared laser and photochemical action of ultraviolet laser are synergistically complemented; a composite modified layer which is composed of a porous deformation layer and an amorphous oxide layer and has a small subsurface layer heat affected zone is constructed on the surface of the fiber reinforced ceramic matrix composite material, and the modified layer has the three functions of being loose and easy to remove, promoting abrasive dust to be discharged and visualizing a thickness scale, so that follow-up fine grinding machining is guided and optimized, and the service life of the fiber reinforced ceramic matrix composite material is prolonged. And finally, high-efficiency, high-quality and low-damage surface precision machining of the material is achieved.

The present application relates to the technical field of vascular interventional treatment instruments, and discloses a system and method for the selective laser ablation of restenosis after the treatment of Budd-Chiari syndrome, comprising a controller, a pulse emission module and a reference element built into a catheter, the system is based on the reference element for periodic self-calibration, collects and processes the associated photoacoustic signals to identify the tissue type, and then realizes the selective ablation of the diseased tissue and the boundary self-stop when the healthy tissue is touched. The present application converts the traditional open-loop energy delivery into a closed-loop self-control process with real-time information interaction capability, so that the ablation operation end can in-situ perceive the tissue boundary and realize autonomous stop, thereby avoiding the problem of damaging the healthy tissue due to uncontrollable energy application, improving the safety of the operation, and having the advantages of high precision, few complications, repeatable treatment and the like.

The invention discloses a method for improving the binding force of an electrolytic copper foil and a base material under low roughness and the electrolytic copper foil. The method comprises the following steps: 1) carrying out smooth acid pickling on a 9-35 [mu] m raw foil; (2) performing picosecond laser selective ablation on bulges of more than 100nm on the surface of the pickled raw foil to enable Ra to be less than or equal to 0.1 mu m; (3) depositing a compact copper layer of 0.1-0.4 mu m to fill the micro pits; 4) coarsening in a coarsening solution containing copper ions, sulfuric acid, sodium tungstate and sodium molybdate; 5) curing in a curing liquid containing copper ions, sulfuric acid, MPS, HEC, PEG and hydrolyzed collagen; (6) heat-resisting treatment and passivating treatment are conducted in sequence; 7) spraying an organic silane coupling agent; and (8) drying at 130-140 DEG C for 5-10 seconds, and then rolling at the speed of 4-6 m / min. According to the method, the formation of a high-roughness structure is avoided through laser leveling, the compact copper layer reinforces the substrate to improve the uniformity of copper nodules, the lamination surface Rz of a final product is smaller than or equal to 1.5 microns, Ra is smaller than or equal to 0.2 microns, the peel strength is larger than or equal to 0.7 N / mm, no copper powder falls off during lamination, and the method is suitable for preparing the high-precision copper foil.

A method for treating a tumor in a subject is provided, the method comprising introducing nanoparticles into the tumor, generating alternating RF magnetic fields microwave electromagnetic waves; measuring temperatures of the tumor and of healthy tissue in close proximity to the tumor; and adjusting one or more properties of the RF magnetic fields and / or microwave electromagnetic waves based on the measured temperatures, such that the combination of the RF magnetic fields and the microwave electromagnetic waves cooperate to heat the tumor region to an ablative temperature without substantially heating the healthy tissue which is in close proximity to the tumor.

The present application relates to the field of radio frequency integrated circuit and advanced semiconductor packaging technology, and particularly relates to a radio frequency resistor calibration structure and manufacturing method based on RDL process, comprising a main resistor module, a redundant resistor module, a laser trimming module, a shielding layer module and a temperature compensation module. The main resistor module is formed by sputtering of low-temperature coefficient metal alloy, and adopts a serpentine or interdigital geometry layout to reduce high-frequency skin effect; the redundant resistor module is driven by metal ion migration through a narrow neck structure and electromigration effect to compensate for photolithography line width deviation and sputtering thickness unevenness. The laser trimming module adjusts the conductive path through selective ablation or annealing by pulsed laser, and forms a closed-loop calibration combined with real-time feedback of the metal sensing electrode. The radio frequency circuit parameter consistency regulation at the packaging level is realized.

The invention provides a dual-channel high-power femtosecond laser deciduous tooth selective ablation system, and relates to the field of solid ultrafast laser. Comprising a laser transmitter, a power output unit and an optical fiber clamp, the power output unit comprises a primary output module and a secondary output module, and the primary output module and the secondary output module are respectively connected with the optical fiber clamp. Through the dual-wavelength laser output system, 1 [mu] m near-infrared femtosecond laser and 6.1 [mu] m and 9.5 [mu] m intermediate-infrared tunable femtosecond laser can be output at the same time, meanwhile, a groove is further formed in the optical fiber clamp, reagents such as a decayed tooth display agent can be stored, the needed reagents can be directly and synchronously injected to a target part, and more convenient and accurate ablation experience is achieved.

Disclosed in the present is materials and methods for delivering substances to plants. The invention describes a method to enhance substances uptake by plants using selective ablation of light pulses to remove the wax cuticle on a large scale in fields, comprising steps of light selective ablation of wax based optical properties of leaves, using lasers, pulsed lamps or other light sources like solar filtered solar light to remove the wax selectively without damage the leaves. Also disclosed is material for enhancing substances uptake by plants using selective ablation of light pulses to remove the wax cuticle, comprising selective ablation of light pulses of a wavelength of about 532 nm or within the range 495 to 570 nm.

The invention relates to the technical field of advanced laser processing, in particular to a graphite material surface planarization treatment method, a functional part and application of the functional part. The method provided by the invention comprises the step of irradiating at least part of the surface of the graphite material by using laser. By the adoption of the method, the original wrinkle height and roughness of the surface of the graphite material can be remarkably reduced, and meanwhile quality damage to a graphite body is avoided. According to the method, the selective ablation effect is generated on the graphite surface by reasonably selecting the laser irradiation process and parameters, so that the defects such as microcosmic wrinkles on the graphite surface are effectively reduced, efficient planarization of the graphite surface is realized, and the surface quality of the graphite material is greatly improved.

The application provides an ablation device and a system thereof, the ablation device comprising a pulse unit and an electrode group; the electrode group comprising a reference electrode, an ablation electrode and a reverse electrode; the pulse unit configuring a pulse voltage to the ablation electrode and the reference electrode, so that the electrode group forms an ablation electric field; the pulse unit configuring a pulse voltage to the ablation electrode and the reverse electrode, so that the electrode group forms a reverse electric field; wherein the ablation electric field and the reverse electric field are alternately formed, and the electric field direction of the ablation electric field and the electric field direction of the reverse electric field are opposite to the position to be ablated. As above, the transmembrane voltage of part of cells at the predetermined tissue can be offset, the time for the cells to form irreversible electroporation is delayed, the area with a certain distance from the predetermined tissue is electrically physiologically ablated, the integrity of the ablation electrode and the predetermined tissue is ensured, and the purpose of selective ablation is achieved.

The invention relates to a processing method of a plastic package IC (integrated circuit) chip, which comprises the following steps: removing a plastic package material on the top surface of the plastic package IC chip by laser selective ablation to expose a gold thread as an end point indication; removing the residual plastic packaging material on the top surface of the plastic packaging IC chip and the plastic packaging material on the side surface and the bottom of the plastic packaging IC chip by using mixed acid of nitric acid and sulfuric acid so as to completely expose the IC chip; removing the polyimide passivation protection layer on the surface of the IC chip by using fuming sulfuric acid to expose a metal wiring layer of the IC chip; and cleaning and drying the IC chip. According to the processing method, through the synergistic effect of laser selective ablation and chemical corrosion, layered removal of the driving IC chip in the intelligent power module is achieved, the original appearance of a failure site is reserved to the maximum extent, reliable guarantee is provided for accurate positioning of a failure mode, and the reliability of the failure mode is improved. And the success rate and the accuracy of failure analysis of the high-end semiconductor device are effectively improved.