6 results about "Selective ablation" patented technology

The present application relates to the technical field of vascular interventional treatment instruments, and discloses a system and method for the selective laser ablation of restenosis after the treatment of Budd-Chiari syndrome, comprising a controller, a pulse emission module and a reference element built into a catheter, the system is based on the reference element for periodic self-calibration, collects and processes the associated photoacoustic signals to identify the tissue type, and then realizes the selective ablation of the diseased tissue and the boundary self-stop when the healthy tissue is touched. The present application converts the traditional open-loop energy delivery into a closed-loop self-control process with real-time information interaction capability, so that the ablation operation end can in-situ perceive the tissue boundary and realize autonomous stop, thereby avoiding the problem of damaging the healthy tissue due to uncontrollable energy application, improving the safety of the operation, and having the advantages of high precision, few complications, repeatable treatment and the like.

A method for treating a tumor in a subject is provided, the method comprising introducing nanoparticles into the tumor, generating alternating RF magnetic fields microwave electromagnetic waves; measuring temperatures of the tumor and of healthy tissue in close proximity to the tumor; and adjusting one or more properties of the RF magnetic fields and / or microwave electromagnetic waves based on the measured temperatures, such that the combination of the RF magnetic fields and the microwave electromagnetic waves cooperate to heat the tumor region to an ablative temperature without substantially heating the healthy tissue which is in close proximity to the tumor.

The invention provides a dual-channel high-power femtosecond laser deciduous tooth selective ablation system, and relates to the field of solid ultrafast laser. Comprising a laser transmitter, a power output unit and an optical fiber clamp, the power output unit comprises a primary output module and a secondary output module, and the primary output module and the secondary output module are respectively connected with the optical fiber clamp. Through the dual-wavelength laser output system, 1 [mu] m near-infrared femtosecond laser and 6.1 [mu] m and 9.5 [mu] m intermediate-infrared tunable femtosecond laser can be output at the same time, meanwhile, a groove is further formed in the optical fiber clamp, reagents such as a decayed tooth display agent can be stored, the needed reagents can be directly and synchronously injected to a target part, and more convenient and accurate ablation experience is achieved.

Disclosed in the present is materials and methods for delivering substances to plants. The invention describes a method to enhance substances uptake by plants using selective ablation of light pulses to remove the wax cuticle on a large scale in fields, comprising steps of light selective ablation of wax based optical properties of leaves, using lasers, pulsed lamps or other light sources like solar filtered solar light to remove the wax selectively without damage the leaves. Also disclosed is material for enhancing substances uptake by plants using selective ablation of light pulses to remove the wax cuticle, comprising selective ablation of light pulses of a wavelength of about 532 nm or within the range 495 to 570 nm.

The application provides an ablation device and a system thereof, the ablation device comprising a pulse unit and an electrode group; the electrode group comprising a reference electrode, an ablation electrode and a reverse electrode; the pulse unit configuring a pulse voltage to the ablation electrode and the reference electrode, so that the electrode group forms an ablation electric field; the pulse unit configuring a pulse voltage to the ablation electrode and the reverse electrode, so that the electrode group forms a reverse electric field; wherein the ablation electric field and the reverse electric field are alternately formed, and the electric field direction of the ablation electric field and the electric field direction of the reverse electric field are opposite to the position to be ablated. As above, the transmembrane voltage of part of cells at the predetermined tissue can be offset, the time for the cells to form irreversible electroporation is delayed, the area with a certain distance from the predetermined tissue is electrically physiologically ablated, the integrity of the ablation electrode and the predetermined tissue is ensured, and the purpose of selective ablation is achieved.

The invention relates to a processing method of a plastic package IC (integrated circuit) chip, which comprises the following steps: removing a plastic package material on the top surface of the plastic package IC chip by laser selective ablation to expose a gold thread as an end point indication; removing the residual plastic packaging material on the top surface of the plastic packaging IC chip and the plastic packaging material on the side surface and the bottom of the plastic packaging IC chip by using mixed acid of nitric acid and sulfuric acid so as to completely expose the IC chip; removing the polyimide passivation protection layer on the surface of the IC chip by using fuming sulfuric acid to expose a metal wiring layer of the IC chip; and cleaning and drying the IC chip. According to the processing method, through the synergistic effect of laser selective ablation and chemical corrosion, layered removal of the driving IC chip in the intelligent power module is achieved, the original appearance of a failure site is reserved to the maximum extent, reliable guarantee is provided for accurate positioning of a failure mode, and the reliability of the failure mode is improved. And the success rate and the accuracy of failure analysis of the high-end semiconductor device are effectively improved.