Adaptive heat and mass transfer radiating device for intelligently responding to hot spots of chip

Abstract

The invention discloses an adaptive heat and mass transfer radiating device for intelligently responding to hot spots of a chip, comprises a heat sink substrate and an upper cover plate. A through hole is formed in the center of the upper cover plate through etching, a central fluid inlet corresponding to the through hole and having the same radius with the through hole is etched in the radiator substrate, a plurality of fractal micro-flow channels communicated with the central fluid inlet are also etched on the heat sink substrate, and a trapezoidal heat shrinkable temperature sensitive hydrogel is embedded in each fractal micro-flow channel and in two branch flow channels, and the embedded hydrogel penetrates into the two branch flow channels. The heat dissipation device has strong heatexchange ability and small flow pressure drop. The embedded heat shrinkable temperature sensitive hydrogel can intelligently respond to the local hot spots of the chip and produce volume change and moisture diffusion and transport under certain temperature conditions, adaptive control of flow channel and flow exchange in branch channels are realized, which realizes automatic redistribution of flowrate, quickly removes heat from local hot spots of the chip, effectively prevents local thermal failure and maintains uniform surface temperature of the chip.

Description

technical field [0001] The invention relates to a chip cooling device, in particular to an adaptive thermal mass transmission cooling device that intelligently responds to chip hot spots. Background technique [0002] In recent years, with the development of microelectronics technology, especially military electronics and microwave devices, high-power electronic chips are developing rapidly in the direction of miniaturization and multi-integration. From an integration perspective, Moore's Law states that the number of semiconductor devices within an IC device will double every 18 months. According to the statistics and forecast report of ITRS in 2014, on the basis of maintaining the same chip size, the number of integrated semiconductors per unit area gradually increases with each year, and the chip feature size is decreasing year by year, resulting in the power density per unit volume of electronic components As the chip gets bigger and bigger, the heat flux density of the...

AI Technical Summary

Problems solved by technology

Due to the fixed structure, this cooling technology can only mechanically cool the hot spots in the fixed area, and the cooling effect on the uncontrollable hot spots of the chip is poor

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