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Display panel, packaging method thereof, and display device

A technology for a display panel and a packaging method, which is applied to organic semiconductor devices, semiconductor devices, electrical components, etc., can solve the problems of low light output efficiency of OLED display panels, low optical coupling efficiency of OLED display panels, etc. The effect of improving the display effect and improving the optical coupling efficiency

Active Publication Date: 2020-02-21
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a display panel, a packaging method thereof, and a display device, which can solve the problem of low light coupling efficiency of the OLED display panel in the related art, resulting in low light extraction efficiency of the OLED display panel.

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  • Display panel, packaging method thereof, and display device
  • Display panel, packaging method thereof, and display device
  • Display panel, packaging method thereof, and display device

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Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0040] As a current-mode light-emitting device, the OLED device has low power consumption, self-luminescence, fast response (response time is about 1 microsecond), wide viewing angle (viewing angle can reach more than 175°), thin thickness and large size Features such as flexible display panels are increasingly being used in the field of high-performance displays.

[0041] figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention, as shown in figure 1 As shown, the display panel includes:

[0042] A base substrate 101, and a TFT 102, a light emitting device 103, and a packaging structure F sequentially arranged on the base substrate 101; wherein the packaging structure F includes...

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Abstract

The invention discloses a display panel, a packaging method thereof, and a display device, and belongs to the field of display technology. The method includes: providing a base substrate; sequentially forming a thin film transistor TFT, a light-emitting device, and a first inorganic barrier layer on the base substrate; forming an organic material layer doped with a foaming agent; performing a foaming treatment on the organic material layer doped with a foaming agent to form a bubble structure inside the organic material layer to obtain an organic scattering layer; The side of the scattering layer away from the base substrate forms a second inorganic barrier layer. The invention solves the problem in the related art that the light coupling efficiency of the OLED display panel is low, resulting in low light extraction efficiency of the OLED display panel. The invention is used for packaging of display panels.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a packaging method thereof, and a display device. Background technique [0002] Since the organic light-emitting material in the organic light-emitting diode (Organic Light-Emitting Diode, OLED) device contacts with water and oxygen, it will affect the light-emitting effect of the organic light-emitting material, and then affect the quality and service life of the OLED device. Therefore, the packaging of the OLED device very important. [0003] In related technologies, flexible OLED devices are usually packaged with laminated films to obtain an OLED display panel. The OLED display panel obtained after packaging includes: a base substrate, a thin film transistor (ThinFilm Transisto, TFT) sequentially arranged on the base substrate, An OLED device, an inorganic barrier layer, and an organic buffer layer and an inorganic barrier layer that are stacked and staggere...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K59/12H10K50/854H10K50/844H10K59/1201H10K71/00H10K2102/3026
Inventor 宫奎张志海段献学李纪龙崔海峰
Owner BOE TECH GRP CO LTD
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