Multilayer substrate integrated waveguide dual-pass band filter

A dual-pass-band filter and substrate-integrated waveguide technology, applied in the field of waveguides, can solve the problems such as the coupling coefficient cannot be adjusted independently, the physical size of the planar coupling structure is large, the processing cost and the system volume are increased, etc. Selective, highly selective effects

Inactive Publication Date: 2018-11-06
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Two passbands are realized by planar coupling between layers. First, the two orthogonal mode TEs in the SIW resonator are excited by the microstrip unbalanced feeding method. 102 and TE 201 mode, the two resonant modes are coupled through the coupling window to generate the first and second passbands respectively, but other spurious modes will also be coupled through the same coupling window, which will inev

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer substrate integrated waveguide dual-pass band filter
  • Multilayer substrate integrated waveguide dual-pass band filter
  • Multilayer substrate integrated waveguide dual-pass band filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] Most of the existing SIW dual-band dual-mode filters adopt planar coupling structure, which has two main disadvantages: 1. The overall size is large; 2. Since multiple resonant modes are coupled through a window, the bandwidth must not be independent control, while being less selective.

[0039] The purpose of the present invention is to solve the problems of the existing SIW dual-band dual-mode filter with large size, uncontrollable passband and low se...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a multilayer substrate integrated waveguide dual-pass band filter, a vertical coupling structure of two-mode resonator is adopted, two passbands are generated by using the resonator's multi-resonant mode characteristics, and each resonant mode is coupled independently by using the orthogonality between different resonant cavities of the SIW resonator. The central frequenciesof the two passbands are adjusted by adjusting the size of the resonator, and the bandwidths of the two passbands are adjusted by adjusting the mixed coupling mode between the resonant modes. As theinvention adopts vertical coupling, the electric coupling, the magnetic coupling or the hybrid coupling between resonant modes can be designed independently by utilizing the orthogonality between different modes, so as to bring greater freedom to the design of the filter. The invention adopts vertical hybrid coupling of the resonant modes to improve the selectivity of the filter.

Description

technical field [0001] The invention relates to the waveguide field, in particular to a multi-layer substrate integrated waveguide double-passband filter. Background technique [0002] With the development of modern wireless communication systems towards high integration and multi-mode communication, the filters in the system are required to have characteristics such as multi-passband, high out-of-band rejection, and compact size. Substrate integrated waveguide (SIW) ) provides an effective solution for the design of microwave and millimeter wave circuits and systems because it can take into account the advantages of compactness, easy integration, and easy processing of the microstrip structure and the low insertion loss and high Q value of the waveguide. At the same time, with the development of modern wireless communication systems towards high integration, high reliability and multi-mode communication, SIW dual-band filters are widely used in current wireless communicatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01P1/203
CPCH01P1/203
Inventor 贾定宏邓建钦姜万顺年夫顺朱伟峰
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap