Modified imidazole epoxy resin latent curing agent as well as preparation method and application

A latent curing agent, epoxy resin technology, applied in the direction of organic chemistry, etc., can solve the problems of affecting the use efficiency of epoxy resin, increasing the cost of use of materials, affecting the physical properties of materials, etc., which is conducive to full curing and industrialized production. , the effect of easy industrial production

Active Publication Date: 2018-11-09
浙江百合航太复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, unmodified imidazole curing agent and epoxy resin will slowly undergo curing reaction at room temperature, so this type of epoxy resin system usually needs to be transported and stored at low temperature, which increases the cost of materials and affects the durability of epoxy resin. Efficiency
[0003] At present, there have been some reports on the latentization of imidazole epoxy resin curing agents at home and abroad, including substitution modification (US4335228, CN106866937A), metal inorganic salt complexation modification (JApp Polym Sci, 1999, 75: 201-207) , microcapsule method (EP543675, CN101016369A), etc., wherein the imidazole curin...

Method used

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  • Modified imidazole epoxy resin latent curing agent as well as preparation method and application
  • Modified imidazole epoxy resin latent curing agent as well as preparation method and application
  • Modified imidazole epoxy resin latent curing agent as well as preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (1) Synthesis of modified imidazoles:

[0023] Add 1-cyanoethyl-2-ethyl-4-methylimidazole (16.3 g, 0.1 mol) and 120 g ethanol into a container, stir for 15 min and set aside. Dissolve copper chloride (3.4g, 0.025mol) in 100g ethanol to form a copper chloride solution, and slowly add it dropwise to the above-mentioned 1-cyanoethyl - In the 2-ethyl-4-methylimidazole solution, the dropping rate is 60 drops / min, and after the dropping, the temperature is raised to 60 degrees Celsius to continue the reaction for 6 hours. After the reaction is completed, the solid by-products produced by the reaction are removed by vacuum filtration, and the obtained filtrate is subjected to vacuum distillation to remove the solvent to obtain a copper chloride-modified imidazole product. The structural composition of the modified imidazole was characterized by elemental analysis and plasma spectroscopic analysis, and the content of each element is shown in Table 1. According to the content ...

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PUM

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Abstract

The invention relates to a curing agent and particularly relates to a modified imidazole epoxy resin latent curing agent as well as preparation method and application. The curing agent is an imidazolemetal salt complex which is prepared by a reaction between 1-cyanoethyl-2-ethyl-4-methylimidazole and a transition metal chloride, wherein in the reaction, an alcohol compound is adopted as a solvent, and the reaction takes for 4-10 h at 60 DEG C; the solvent is removed by vacuum suction filtration and reduced-pressure distillation to obtain the product. The prepared curing agent and the epoxy resin have the characteristics of high compatibility, long room-temperature storage life and high reaction activity at high temperature; the epoxy curing product has good heat resistance and mechanicalproperty. The curing agent can serve as an epoxy resin latent curing agent and has a good application prospect in the fields of composite material production, adhesives, etc.

Description

technical field [0001] The invention relates to a curing agent, in particular to a latent curing agent for modified imidazole epoxy resins, a preparation method and an application. Background technique [0002] Epoxy resin is widely used in coatings, adhesives, composite material manufacturing and other fields due to its good heat resistance, mechanical properties, adhesion, electrical insulation and chemical corrosion resistance. Epoxy resin is generally a liquid or solid small molecule or oligomer at room temperature, and forms a thermosetting polymer material after a curing reaction with a curing agent. Epoxy resins can undergo curing reactions with a variety of curing agents, such as amines, acid anhydrides, mercaptans, phenols, phenolic and imidazole curing agents. Among them, imidazole curing agents are widely used in epoxy resin products because of their wide curing temperature, high curing efficiency, high modulus and good heat resistance of cured products. However...

Claims

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Application Information

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IPC IPC(8): C08G59/50C07D233/61
CPCC07D233/61C08G59/5093
Inventor 于亮亮刘万双魏毅
Owner 浙江百合航太复合材料有限公司
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