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Photo-sensor packaging material

A packaging material and light sensor technology, applied in the sensor field, can solve problems such as high cost, uneven process grades, and inability to meet production needs.

Inactive Publication Date: 2018-11-13
佛山市影腾科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the products produced by this type of process are of uneven process grade and high cost, they cannot meet the actual production needs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] An embodiment of the present invention provides a photosensor packaging material, which is composed of the following raw materials in parts by weight: 5 parts by weight of bisphenol A epoxy resin, 23 parts by weight of methyl hexahydrophthalic anhydride, parts by weight of 11 titanium dioxide, 15 parts by weight of vinyltrimethoxysilane, 5 parts by weight of MDT resin, 2 parts by weight of ethylene-vinyl acetate copolymer, 5 parts by weight of sodium tripolyphosphate, parts by weight 3 parts by weight of propylene glycol alginate, 3 parts by weight of polyglycerol fatty acid ester, 1 part by weight of aluminum oxide, and 3 parts by weight of propylene glycol alginate.

Embodiment 2

[0019] An embodiment of the present invention provides an optical sensor packaging material, which consists of the following raw materials in parts by weight: 25 parts by weight of bisphenol A epoxy resin, 8 parts by weight of methyl hexahydrophthalic anhydride, parts by weight of 20 parts by weight of titanium dioxide, 8 parts by weight of vinyltrimethoxysilane, 9 parts by weight of MDT resin, 5 parts by weight of ethylene-vinyl acetate copolymer, 1 part by weight of sodium tripolyphosphate, parts by weight of 9 parts of propylene glycol alginate, 1 part by weight of polyglycerol fatty acid ester, 4 parts by weight of aluminum oxide, and 2 parts by weight of propylene glycol alginate.

Embodiment 3

[0021] The embodiment of the present invention provides an optical sensor packaging material, which is composed of the following bisphenol A epoxy resin in parts by weight of 8, methylhexahydrophthalic anhydride in parts by weight of 15 parts, titanium dioxide in parts by weight of 13 parts by weight, Parts are 9 vinyl trimethoxysilane, 7.5 parts by weight of MDT resin, 3.5 parts by weight of ethylene-vinyl acetate copolymer, 2 parts by weight of sodium tripolyphosphate, 6 parts by weight of propylene alginate Diester, 1.5 parts by weight of polyglycerol fatty acid ester, 2.5 parts by weight of aluminum oxide, and 2 parts by weight of propylene glycol alginate.

[0022] The photosensor packaging material also includes 8 parts by weight of potassium dihydrogen phosphate. The photosensor packaging material also includes 2 parts by weight of sodium thiosulfate. The photosensor packaging material also includes 4 parts by weight of tungsten oxide.

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PUM

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Abstract

The invention provides a photo-sensor packaging material, comprising, by weight, 5-25 parts of bisphenol A epoxy resin, 8-23 parts of methylhexahydrophthalic anhydride, 11-20 parts of titanium dioxide, 8-15 parts of vinyl trimethoxy silane, 5-9 parts of MDT (Me3SiO, Me2SiO2 and MeSiO3) resin, 2-5 parts of ethylene-vinyl acetate copolymer, 1-5 parts of sodium tripolyphosphate, 3-9 parts of propylene glycol alginate, 1-3 parts of polyglycerol fatty acid ester, 1-4 parts of aluminum oxide, and 2-3 parts of propylene glycol alginate. The photo-sensor packaging material is provided herein which canstably maintain near-infrared blocking, visible light transmittance and broad band and which is transaprent and infrared resistant; the photo-sensor packaging material is an excellent near-infrared blocking epoxy resin composition for semiconductor packaging and is particularly suitable for converting spectral characteristics of photoelectric receiving components.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to an optical sensor packaging material. Background technique [0002] A visible light sensor in the prior art is a sensor that can detect a spectrum similar to the range of the human eye. Such sensors mainly use silicon photodiodes, silicon phototransistors, etc. as detectors directly. Belonging to a single photoelectric sensor, the incident spectrum usually corresponds to a larger bandwidth (visible light to near infrared). For example: silicon photodiodes, triode products, incident wavelengths from 300nm to 1100nm, have photoelectric conversion effects within this range. And most of them don't have gain amplifier transistors. CdS photoresistor is the best visible light detector, but the production process of the product is complicated, and it contains high content of cadmium sulfide, which has been approved by the European Union. The photoresistor made of cadmium sulfide mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L23/08C08L5/04C08K13/02C08K5/5425C08K3/32C08K3/22
CPCC08K2003/2227C08K2003/2241C08K2003/2258C08K2003/324C08L63/00C08L2203/206C08L2205/025C08L2205/035C08L23/0853C08L5/04C08K13/02C08K5/5425C08K3/32C08K3/22
Inventor 朱腾飞
Owner 佛山市影腾科技有限公司
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