Method for laser machining of large depth-to-width-ratio vertical grooves in diamond

Abstract

The invention provides a method for the laser machining of large depth-to-width-ratio vertical grooves in a diamond and belongs to the field of the special machining of difficult-to-cut materials. Thesurface of a sample is scanned by utilizing a laser beam, and the vertical grooves of which the depth-to-width ratio is larger than 9 are machined in the diamond. The laser beam is femtosecond laser,pulse width is 100-300fs, the sample is horizontally fixed onto a workbench, and the height of the workbench is adjusted until the to-be-machined surface of the sample is on the focal plane of the laser beam. An included angle between a laser head and the to-be-machined surface of the sample is adjusted until the incident angle of the laser beam is 4-10 degrees. The laser beam and nitrogen assisting gas are started, and the laser beam is controlled to carry out linear scanning on the surface of the sample in the x-axle direction. Then, the laser beam is fed in the Y-axle direction and carriesout scanning in the direction opposite to the x-axle scanning direction. The laser beam scans a rectangular zone on the surface of the sample, and is fed in the depth direction to a set depth, takenout and ultrasonically cleaned. The method realizes the large depth-to-width-ratio laser machining of the vertical grooves of which the depth-to-width ratio is larger than 9 in the diamond.

Description

technical field [0001] The invention relates to a laser processing method for a vertical groove with a large aspect ratio of diamond, in particular to a method for processing a vertical groove with a large aspect ratio of a superhard material, and belongs to the field of special processing of difficult-to-machine materials. Background technique [0002] With the development of my country's national defense, aviation, aerospace and other major projects, the requirements for high-performance equipment are getting higher and higher. High-performance parts that require high-performance equipment can be Long term and stable job. As an ultra-wide bandgap semiconductor, diamond is the hardest material in the world. It has excellent mechanical, optical, and electrical properties. It is widely used in semiconductors, high-energy physics detectors, radiation detectors, and laser optical components. However, due to its high hardness, good wear resistance and stable chemical properties,...

AI Technical Summary

Problems solved by technology

However, due to the high hardness, good wear resistance and stable chemical properties of diamond, it is difficult to process it by traditional mechanical processing methods. The currently developed methods of processing diamond include chemical mechanical polishing, thermochemical polishing, and ion beam sputtering. , laser cutting, etc., but these methods are often used to process planes. For diamonds with large aspect ratio vertical grooves, the current processing methods are still difficult to process.