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Design method for board-level low DC impedance coplanar electromagnetic bandgap power supply layer of airborne computer

An airborne computer, electromagnetic bandgap technology, applied in CAD circuit design, design optimization/simulation, special data processing applications, etc., can solve problems such as hindering the improvement of power board performance, low design efficiency, and inability to meet design requirements, etc. Achieve the effect of reducing design cost, improving reliability, and optimizing design results

Active Publication Date: 2020-05-26
XI AN JIAOTONG UNIV
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Problems solved by technology

This design is inefficient and hinders the improvement of the performance of the power board and cannot meet the design requirements

Method used

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  • Design method for board-level low DC impedance coplanar electromagnetic bandgap power supply layer of airborne computer
  • Design method for board-level low DC impedance coplanar electromagnetic bandgap power supply layer of airborne computer
  • Design method for board-level low DC impedance coplanar electromagnetic bandgap power supply layer of airborne computer

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Embodiment Construction

[0047] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0048] refer to figure 1 A method for designing an airborne computer board-level low DC impedance coplanar electromagnetic bandgap power supply layer, comprising the following steps:

[0049] 1) Construction of the equivalent model: the selected electromagnetic bandgap unit is equivalent to have conductivity σ 0 The metal patch, and the material of this metal patch is used as the material of the low conductivity substrate in the model, with high conductivity σ p The copper power distribution channel is grown and formed on the upper part of the substrate material; at the same time, a valid assumption is made that the current infiltrates uniformly over the entire surface of the equivalent metal patch;

[0050] Such as figure 2 As shown, for a certain EBG structure, it can be equivalent to a rectangular metal patch with the same size but low ...

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Abstract

The invention provides a design method of an airborne computer board level low DC Impedance coplanar electromagnetic band-gap power supply layer. The equivalent model is constructed first, then initialization of the finite element model of the base structure is performed, then the flexible growth unit is constructed, then finite element analysis is performed, then adaptive growth is performed, andgrowth competition and configuration reconstruction are iterated under the updating of the MMA algorithm until the material consumption reaches the maximum value beta0 set in initialization. The performance parameters of the power supply layer can be obtained through the finite element method in the design stage so as to enhance the reliability of the design, have higher design efficiency than that of the conventional design, obtain better design result and reduce the design cost.

Description

technical field [0001] The invention relates to the technical field of power supply board design, in particular to a design method for a board-level low DC impedance coplanar electromagnetic bandgap power supply layer of an airborne computer. Background technique [0002] With the increase of digital circuit speed, clock frequency and PCB design complexity, related power integrity issues are becoming more and more prominent. Compared with ordinary electronic equipment, airborne computers have a harsher working environment and higher performance standards, which also put forward higher requirements for power integrity. [0003] PCB power integrity issues mainly involve two parts: voltage drop and signal noise. Because these two parts have opposite effects to a certain extent, in order to achieve the overall optimal balance, the design of the power distribution network becomes the key. [0004] The existing power distribution network design still adopts the traditional metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/23G06F30/39
CPCG06F30/23G06F30/39
Inventor 李宝童王亚楠宣承斌陈豪洪军
Owner XI AN JIAOTONG UNIV
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