Design method for board-level low DC impedance coplanar electromagnetic bandgap power supply layer of airborne computer
An airborne computer, electromagnetic bandgap technology, applied in CAD circuit design, design optimization/simulation, special data processing applications, etc., can solve problems such as hindering the improvement of power board performance, low design efficiency, and inability to meet design requirements, etc. Achieve the effect of reducing design cost, improving reliability, and optimizing design results
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[0047] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0048] refer to figure 1 A method for designing an airborne computer board-level low DC impedance coplanar electromagnetic bandgap power supply layer, comprising the following steps:
[0049] 1) Construction of the equivalent model: the selected electromagnetic bandgap unit is equivalent to have conductivity σ 0 The metal patch, and the material of this metal patch is used as the material of the low conductivity substrate in the model, with high conductivity σ p The copper power distribution channel is grown and formed on the upper part of the substrate material; at the same time, a valid assumption is made that the current infiltrates uniformly over the entire surface of the equivalent metal patch;
[0050] Such as figure 2 As shown, for a certain EBG structure, it can be equivalent to a rectangular metal patch with the same size but low ...
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