On-chip network testing package based on one-way transmission path

Abstract

The reliability of an on-chip multi-core system is even more important due to the progress of a semiconductor manufacturing process and the reduction of a feature size. The invention discloses an on-chip network testing package based on a one-way transmission path. The testing package serves the one-way transmission path as a testing object, and the one-way transmission path is served as a basic composition unit of an on-chip network by replacing a traditional router and a link structure; the one-way transmission path is defined as a one-way data access between adjacent on-chip network resource nodes, and a control logic unit in tight function coupling with the one-way data access. Based on the testing package, an idle one-way path in the on-chip network can be online tested, the fixed type and bridge type faults are detected by utilizing built-in self-testing, and the faults can be efficiently positioned to one one-way transmission path; the testing way cannot produce negative influence on an application operated in the system. The on-chip network testing package disclosed by the invention can effectively improve the testability and observability of the multi-core on-chip system,and then the reliability of a digital system is improved.

Description

technical field [0001] The invention relates to an on-chip network test encapsulation based on a unidirectional transmission path, and belongs to the field of on-chip network test encapsulation. Background technique [0002] With the advancement of integrated circuit manufacturing technology and the increase of parallel computing requirements, it has become a trend to integrate resources such as many processor cores on a single chip. The ensuing large amount of traffic demand makes the network on chip become an important interconnection communication structure of the multi-core system. Compared with the bus-based communication structure, the network on chip has better scalability and higher bandwidth. [0003] Shrinking feature sizes make modern integrated circuits increasingly sensitive to variables such as temperature, voltage, and process. In the process of production and use, changes in process parameters, particle impact, aging phenomena, etc. will introduce physical ...

AI Technical Summary

Problems solved by technology

In addition, link-based test encapsulation usually only tests the links between adjacent resource nodes, and cannot cover the control logic circuits located in routers, making the test not comprehensive enough

Images