A semiconductor silicon wafer grinding processing system

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor silicon wafer grinding processing system. The semiconductor silicon wafer grinding processing system comprises a box body, a first pneumatic cylinder, an upper grinding disk, a grinding module, a control module and a collecting box. The grinding module comprises a first grindingmodule and a second grinding module, and the first grinding module and the second grinding module are of the same structure. The first grinding module is installed on the control module, and the second grinding module is located below the first grinding module. The control module is located in the middle of the box body, and the collecting box is fixedly installed at the bottom of the box body. Aswing ball sequentially passes through circular grooves of different sizes when the swing ball rotates, so that the lower grinding disk is extruded by the swing ball and inclined to one side, and thecontact area between a wafer and the upper grinding disk is increased; and meanwhile, the swinging ball is affected by the joint action of the elastic force and centrifugal force of a first plate, sothat the swinging ball strikes the lower grinding disk and the lower grinding disk shakes, and thus the grinding efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor silicon wafer grinding and processing system. Background technique [0002] After the silicon wafer is cut, it must be ground. The quality of the silicon wafer grinding is mainly determined by the shape of the cut. Although the irregular shape of the silicon wafer can be ground, the grinding efficiency is very low. [0003] In traditional silicon wafer grinding equipment, the silicon wafer to be ground is held by the silicon wafer holding plate (carrier) of the grinding head, so that the surface of the silicon wafer is in contact with the grinding cloth attached to the upper surface of the grinding plate , and in a state where the polishing liquid is supplied to the polishing cloth, the polishing plate and the polishing head are moved relative to each other, so that the surface of the silicon wafer can be polished. [0004] There are also some...

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Problems solved by technology

[0005] This technical solution can ensure the grinding and cleaning of silicon wafers; however, this solution cannot effectively target silicon wafers of different regular shapes. When the end of the silicon wafer is cut, conventional grinding methods need to be used from the top a little bit downward. Grinding, its grinding efficiency is low, so that the program is limited

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