Unlock instant, AI-driven research and patent intelligence for your innovation.

Developing device and circuit board manufacturing method

A manufacturing method and circuit substrate technology, applied to photosensitive materials used in optomechanical equipment, processing of photosensitive materials, etc., can solve problems such as retention of developer solution, insufficient development, and reduced replacement efficiency of developer solution, so as to prevent uneven development Effect

Inactive Publication Date: 2018-11-23
TORAY IND INC
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Among them, in the shower-type developing method using a long PET film, the developer is sprayed and supplied onto the substrate as described above, so the developer tends to stay on the film substrate, and the replacement efficiency of the developer decreases, resulting in development Insufficient parts and overdeveloped parts
In addition, the remaining developing solution flows into the cleaning step which is the next step, and there is a problem of contamination of the cleaning solution.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Developing device and circuit board manufacturing method
  • Developing device and circuit board manufacturing method
  • Developing device and circuit board manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122] In a three-necked flask equipped with a stirring device and a thermometer, 60 g of a binder polymer (TR-2500 manufactured by Negami Kogyo Co., Ltd.) and 100 g of diethylene glycol monobutyl ether acetate after vacuum drying at 50° C. for 48 hours were weighed. Heat and dissolve at 60°C. Cool the flask to 30°C, add 5g of isooctyl acrylate, 25g of dipentaerythritol hexaacrylate, and 1,6-hexanediol bis[(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] 0.1 g, 5 g of 1-hydroxycyclohexyl phenyl ketone, and 2 g of a dispersant (manufactured by Kyoeisha Chemical Co., Ltd., "Flowlen (registered trademark)" G-700DMEA) were stirred for 2 hours. 120 g of the obtained organic component and the average particle size of 1.19 μm and the specific surface area of ​​1.12 m produced by the wet reduction method 2 / g, tap density is 4.8g / cm 3 The Ag powder was kneaded with a three-roll mill to obtain a negative photosensitive resin composition.

[0123] This negative photosensitive resin com...

Embodiment 2

[0126] In Example 1, the conveyance speed was set to 7.5 m / min, and the conditions other than that were similar to Example 1, and the preparation of the conductive pattern was performed.

Embodiment 3

[0128] In Example 1, the conveyance speed was set to 0.2 m / min, and the conditions other than that were carried out similarly to Example 1, and preparation of the conductive pattern was performed.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The present invention addresses the problem of providing a developing device and a circuit board manufacturing method with which development unevenness can be prevented at a step for performing, by ashower method, development on a long film and with which a developer can be prevented from flowing into a cleaning liquid tank without utilizing air cutting. The method for manufacturing circuit boards comprises, in this order: a developing step for substantially horizontally conveying a base material having thereon a coating film on which a latent image is formed, and spraying a developer onto the base material; a cleaning step for spraying a cleaning liquid so as to dilute the developer; and a drying step for removing the liquid components, wherein, at the developing step, the developer is sprayed toward the upstream side by multiple spraying nozzles. In the method for manufacturing circuit boards, when the direction of conveyance of the base material, the vertical direction, and a device-width direction are respectively defined as an X direction, a Z direction, and a Y direction, the acute-angle-side angle alpha' formed between the X direction and a straight line O'XZ obtained by projecting, in the Y direction and onto an XZ plane, the spraying direction O' of the developer sprayed from the spraying nozzles is 45-85 degrees, and the acute-angle-side angle beta' formed between the X direction and a straight line P' connecting a string of spraying holes of the spraying nozzles is 45-80 degrees.

Description

technical field [0001] The present invention relates to a developing device and a method for manufacturing a circuit board, for example, to a developing device used when forming a circuit board by forming predetermined wiring electrodes on a base material in the manufacture of a touch panel, and to a circuit board using the developing device manufacturing method. Background technique [0002] A touch panel is an electronic component that combines a display device with a touch coordinate detection device such as a touch panel, and is often incorporated into devices that mainly require intuitive handling. Specifically, it is mounted on mobile terminals such as mobile phones and tablet PCs, and in recent years, touch panels have been required to be thinner, lighter in weight, narrower in frame, and lower in cost. [0003] Prior to this, as the substrate 19 of the touch module used in touch coordinate detection devices such as touch panels, glass with tin-doped indium oxide (he...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/30G03F7/004
CPCG03F7/004G03F7/30
Inventor 中山拓哉堀内健
Owner TORAY IND INC