High-speed high-resolution selective transfer printing method

A high-resolution, transfer printing technology, applied in the direction of printing, copying/marking methods, etc., can solve the problem of difficult debonding of components, and achieve the effect of low cost, high speed and large throughput

Active Publication Date: 2018-12-07
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, the shape memory polymer material is in a low modulus, strong adhesion state after heating, which makes it difficult to debond the component during printing.

Method used

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  • High-speed high-resolution selective transfer printing method
  • High-speed high-resolution selective transfer printing method
  • High-speed high-resolution selective transfer printing method

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Embodiment Construction

[0038] The content of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0039] figure 1is the flowchart of the programmable transfer proposed in the present invention. First contact the component on the donor substrate with a thermal release tape, and after applying uniform pressure, the component is picked up from the donor substrate by relying on the strong adhesion of the thermal release tape to the component; then use a high-resolution local heat source to selectively heat the adhered component The thermal release tape, heating part of the tape loses its viscosity; finally, the components are printed on the receptor substrate, and the components are selectively printed from the thermal release tape to the receptor substrate.

[0040] As an example, but not to limit the scope of the invention, figure 2 is a schematic diagram of the batch programmatic transfer proposed in the present invention. Stamp tr...

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PUM

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Abstract

The invention discloses a high-speed high-resolution selective transfer printing method. The high-speed high-resolution selective transfer printing method comprises the following steps of: enabling thermal release adhesive tape to be in contact with an element on a donor substrate, and picking up the element from the donor substrate by virtue of strong adherency of the thermal release adhesive tape and the element; using a high-resolution local heat source to selectively heat the thermal release adhesive tape adhering to the element, and enabling the heated adhesive tape to lose viscidity; andenabling the thermal release adhesive tape to be in contact with an acceptor substrate, thereby realizing selectively printing the element onto the acceptor substrate from the thermal release adhesive tape. The method is wide in range of application, and can adopt different forms to realize a pick-up process and a printing process for a rigid or flexible substrate. Selective heating of the localheat source can be realized by integrating a high space resolution laser beam with a galvanometer field lens or a displacement platform to scan, and adopting ways such as parallel light source mask heating or micro heater array heating. The method has the advantages of being high in reliability, high in speed, great in throughput capacity, capable of programming a transfer printing pattern and high in transfer printing resolution.

Description

technical field [0001] The invention relates to a transfer printing technology, in particular to a high-speed and high-resolution selective transfer printing method, which can be used for the deterministic assembly of any patterned micro-nano structure. Background technique [0002] Transfer printing technology is a technology that integrates micro-nano materials into spatially ordered two-dimensional or three-dimensional functional modules. Transfer printing technology can be applied to the preparation of some heterogeneous and uneven high-performance integrated functional systems, such as Flexible optical / electronic devices, three-dimensional or curved optical / electronic devices, biocompatibility detection and measurement equipment. This technology can effectively integrate different types of independently prepared discrete components on a large scale to form a spatially ordered functional system. It can transfer a wide range of materials, from complex molecular materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/382
CPCB41M5/382B41M5/38221B41M5/38257
Inventor 令狐昌鸿王成军宋吉舟俞凯鑫李城隆曾寅家朱昊东
Owner ZHEJIANG UNIV
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