A memristive switch device based on a-tsc:o ceramic film and its preparation method
A technology of ceramic thin film and switching devices, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of research reports that have not been applied in the field of optoelectronics, and achieve good near-infrared transmittance, good Resistive switching performance, the effect of simple preparation process
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Embodiment 1
[0031] This embodiment provides a memristive switch device, such as figure 1 As shown, its structure from bottom to top is "ITO slide 1, a-TiOx Thin film 2, a-TSC:O thin film 3, a-TSC thin film 4 "vertical four-layer structure," a-TiO x Thin film 2 / a-TSC:O thin film 3" double-layer structure acts as a double resistance layer (that is, the dielectric layer of the memristive switching device).
[0032] This embodiment provides a method for preparing the above-mentioned memristive switch device, and the preparation process includes the following steps:
[0033] Step A: prepare the ITO glass slide 1 as a transparent substrate with a bottom electrode, and perform cleaning and drying according to a standard process;
[0034] Step B: using a titanium target as a raw material target, oxygen and argon as a working gas, and depositing an a-TiOx thin film 2 on an ITO glass substrate 1 by reactive radio frequency sputtering as a first resistive layer;
[0035] Step C: Using Ti 3 SiC 2...
Embodiment 2
[0052] This embodiment provides a method for preparing a memristive switch device, and the preparation process includes the following steps:
[0053] Step A: Prepare a K9 glass substrate as a transparent substrate, and perform cleaning and drying according to standard processes; then deposit an ITO film on it as a bottom electrode;
[0054] Step B: using a titanium target as a raw material target, oxygen and argon as a working gas, and depositing an a-TiOx film on the ITO film by reactive radio frequency sputtering as the first resistive layer;
[0055] Step C: Using Ti 3 SiC 2 The polycrystalline powder is used as the raw material target, oxygen and argon are used as the working gas, and the a-TSC:O film is deposited on the a-TiOx film by reactive radio frequency sputtering as the second resistive layer. The specific operation is as follows:
[0056] C1: Target preparation:
[0057] Ti 3 SiC 2 Add the powder into deionized water and stir evenly to obtain Ti 3 SiC 2 dis...
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Abstract
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