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Efficient VCP copper-plating brightening agent

A technology of brightener and copper plating, which is applied in the field of brightener, can solve problems such as inability to meet PCB manufacturing requirements, and achieve the effects of excellent deep plating ability, excellent throwing ability, and no stress on the coating

Active Publication Date: 2018-12-07
惠州市荣安达化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, with the rapid development of consumer electronics products, the functions are also constantly upgraded, and higher requirements are put forward for printed circuit boards carrying electronic components. The uniformity of the copper plating layer on the board also puts forward higher requirements. The original deviation of 4 microns can no longer meet the requirements of 3 / 3mil circuit manufacturing. As a traditional copper plating line: Longmen line, it can no longer meet the more precise PCB manufacturing. Therefore, in recent years, some PCB manufacturers have completely eliminated the traditional gantry line-type copper-tin plating production line, and instead adopted a more advanced vertical continuous plating line (VCP) type electric copper production line.

Method used

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  • Efficient VCP copper-plating brightening agent
  • Efficient VCP copper-plating brightening agent
  • Efficient VCP copper-plating brightening agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Components and ratios (parts by weight) are as follows: polyether 10, leveling aid 5, sulfuric acid 0.5, polydithiodipropanesulfonate sodium 0.15, quaternary ammonium salt 0.5, formaldehyde 0.2, copper sulfate pentahydrate 0.25, deionized Water 83.4.

[0021] Preparation steps:

[0022] a. Add deionized water into the reaction kettle, start stirring, slowly add sulfuric acid, and stir evenly.

[0023] b. Add polyether, leveling aid, sodium polydisulfide dipropane sulfonate, and quaternary ammonium salt to the reaction kettle in sequence and stir until completely dissolved.

[0024] c. Add formaldehyde to the reactor and stir evenly.

[0025] d. Add copper sulfate pentahydrate to the reaction kettle, stir until it is completely dissolved and evenly, and then the brightener is prepared

Embodiment 2

[0027] Polyether 12, leveling aid 4, sulfuric acid 0.5, sodium polydisulfide dipropane sulfonate 0.16, quaternary ammonium salt 0.6, formaldehyde 0.24, copper sulfate pentahydrate 0.2, deionized water 82.3. The preparation steps are the same as in Example 1.

Embodiment 3

[0029] Polyether 14, leveling aid 6, sulfuric acid 0.5, sodium polydisulfide dipropane sulfonate 0.15, quaternary ammonium salt 0.7, formaldehyde 0.2, copper sulfate pentahydrate 0.25, deionized water 77.95. Preparation steps are with embodiment 1

[0030] The VCP high-efficiency copper-plating brightener of the present invention is compared with a brightener of a famous brand in the United States, which is replaced by the code name J, and a brightener of a certain domestic brand is replaced by the code name B, for all-round performance comparison. The specific sample preparation is as follows: PCB with holes drilled There are 25 substrates, 5 boards for each brightener are used as experimental test boards, the test results are averaged, the ratio of thickness to diameter is 8:1, the thickness of substrate copper is 14 microns, the size is 603mm*518mm, the line speed is 0.7m / min, and the copper The thickness is 31.2 microns, and the current density is 4.2ASD.

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Abstract

The invention discloses an efficient VCP copper-plating brightening agent. The efficient VCP copper-plating brightening agent comprises, by mass, 10-15 parts of polyether, 3-8 parts of a leveling auxiliary, 0.4-0.6 part of sulfuric acid, 0.1-0.2 part of dithiobis-1-propanesulfonic acid disodium salt, 0.4-0.8 part of quaternary ammonium salt, 0.1-0.3 part of formaldehyde, 0.1-0.3 part of blue vitriol and 75-88 parts of deionized water. When the surface of a through hole in a substrate of a printed circuit board is plated with copper in VCP, the efficient VCP copper-plating brightening agent hasgood uniform plating capacity and deep plating capacity, the ductility of the surface placed with copper is excellent, a smooth and bright curved surface is formed, and a coating is free of stress.

Description

technical field [0001] The invention belongs to the technical field of brighteners, in particular to a VCP high-efficiency copper plating brightener. Background technique [0002] In recent years, with the rapid development of consumer electronics products, the functions are also constantly upgraded, and higher requirements are put forward for printed circuit boards carrying electronic components. The uniformity of the copper plating layer on the board also puts forward higher requirements. The original deviation of 4 microns can no longer meet the requirements of 3 / 3mil circuit manufacturing. As a traditional copper plating line: Longmen line, it can no longer meet the more precise PCB manufacturing. Therefore, in recent years, some PCB manufacturers have completely eliminated the traditional gantry line-type copper-tin plating production line, and instead adopted a more advanced vertical continuous plating line (VCP) type electric copper production line. [0003] In the v...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 黄昌希刘平
Owner 惠州市荣安达化工有限公司
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