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PCB electroplating solution

A PCB board and electroplating solution technology, applied in the field of PCB surface electroplating, can solve problems such as inability to peel off, a large amount of nitric acid solution, serious pollution of the working environment and the health of operators, and achieve the effect of long service life

Inactive Publication Date: 2018-12-07
昆山雅鑫化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing technology is the method that adopts nitric acid to chemically peel off the copper / tin / nickel layer as electrolyte, is about to immerse the hanger in the nitric acid solution, and the copper / tin / nickel on the hanger surface will be corroded by nitric acid and peeled off, but this The method will corrode the hanger itself after copper / tin / nickel stripping, but this method cannot completely strip the copper / tin / nickel on the overall surface of the hanger; in addition, this method consumes a lot of The nitric acid solution seriously pollutes the working environment and the health of operators, and increases the cost of waste gas recovery and waste gas treatment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A kind of PCB board electroplating liquid, described electroplating liquid is neutral solution, and it comprises acid, salt, demetallization additive and deionized water;

[0017] Wherein, by weight, described acid is 200 parts, and salt is 50 parts, and metal stripping additive is 70 parts, and deionized water is 800 parts.

[0018] In this embodiment, the acid is methanesulfonic acid.

[0019] In this embodiment, the salt is tin methanesulfonate.

[0020] In this embodiment, the metal stripping additive is a copper stripping or tin stripping or nickel stripping additive.

[0021] In this embodiment, chloride ions are also included.

[0022] In this embodiment, a tin complexing agent is also included, and the weight part of the tin complexing agent is 100 parts.

[0023] In this embodiment, a copper protecting agent is also included, and the weight part of the copper protecting agent is 50 parts.

[0024] When the electroplating solution of the present invention is...

Embodiment 2

[0026] A kind of PCB board electroplating liquid, described electroplating liquid is neutral solution, and it comprises acid, salt, demetallization additive and deionized water;

[0027] Wherein, by weight, described acid is 350 parts, and salt is 80 parts, and metal stripping additive is 120 parts, and deionized water is 900 parts.

[0028] In this embodiment, a tin complexing agent is also included, and the weight part of the tin complexing agent is 150 parts.

[0029] In this embodiment, a copper protecting agent is also included, and the weight part of the copper protecting agent is 65 parts.

Embodiment 3

[0031] A kind of PCB board electroplating liquid, described electroplating liquid is neutral solution, and it comprises acid, salt, demetallization additive and deionized water;

[0032] Wherein, in parts by weight, the acid is 500 parts, the salt is 110 parts, the metal stripping additive is 160 parts, and the deionized water is 1000 parts.

[0033] In this embodiment, a tin complexing agent is also included, and the weight part of the tin complexing agent is 200 parts.

[0034] In this embodiment, a copper protecting agent is also included, and the weight part of the copper protecting agent is 80 parts.

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PUM

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Abstract

The invention discloses a PCB electroplating solution. The electroplating solution is a neutral solution, and comprises the following components of, by weight, 200-500 parts of acid, 50-110 parts of salt, 70-160 parts of a metal removing additive, and 800-1000 parts of deionized water. The PCB electroplating solution has the advantages of being environmentally friendly, zero in emission and long in service life, and a flying target hanger does not need to be replaced by a hanger made of a titanium 2 material, stripping and recovery of copper, tin and nickel on a PCB can be realized only by using a conventional hanger made of 304 stainless steel or 316 stainless steel material.

Description

technical field [0001] The invention relates to the technical field of PCB surface electroplating, in particular to a PCB electroplating solution. Background technique [0002] In the electroplating process of PCB production, because the PCB is hung on the flying target hanger of the electrolytic tank for electroplating, copper / tin / nickel will also be plated on the flying target hanger. Existing technology is the method that adopts nitric acid to chemically peel off the copper / tin / nickel layer as electrolyte, is about to immerse the hanger in the nitric acid solution, and the copper / tin / nickel on the hanger surface will be corroded by nitric acid and peeled off, but this The method will corrode the hanger itself after copper / tin / nickel stripping, but this method cannot completely strip the copper / tin / nickel on the overall surface of the hanger; in addition, this method consumes a lot of The nitric acid solution seriously pollutes the working environment and the health of op...

Claims

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Application Information

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IPC IPC(8): C25F3/02
Inventor 孙仕明
Owner 昆山雅鑫化工有限公司
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