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A graphene heat sink

A technology of graphene and heat sink, which is applied in the direction of heating element materials, etc., can solve the problems of high thermal conductivity without graphene and the application of heating elements in the heating field, affecting the heat dissipation performance of graphene, and complicated preparation process, etc., to achieve ingenious structural design , good thermal conductivity, high specific surface area effect

Inactive Publication Date: 2021-05-25
大连东方腾飞建筑装饰工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process of graphene coating is relatively complicated and time-consuming, and the binder used in the coating will affect the heat dissipation performance of graphene
And in the prior art, the high thermal conductivity of graphene has not been combined with heating elements to make it used in heating fields, such as ovens, etc.

Method used

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Embodiment Construction

[0016] The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them.

[0017] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two component...

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Abstract

The graphene thermally conductive heat sink provided by the present invention includes a heating sheet and a graphene composite layer, wherein the heating sheet generates heat when it is energized, and the graphene composite layer has excellent heat dissipation performance and can dissipate the heat generated by the heating sheet. The heating sheets and the graphene composite layers are arranged alternately and connected in series. The graphene composite layer comprises a first graphene layer, a second graphene layer and a porous graphite layer, the porous graphite layer is located between the first graphene layer and the second graphene layer, the first graphene layer and the second graphene layer The two graphene layers are closely attached to the heating sheets on both sides of the graphene composite layer respectively, and the heat conduction efficiency is high; while the porous graphite layer is located between the first graphene layer and the second graphene layer, and the porous graphite has mutual The interconnected and open pores make the porous graphite layer have a very high specific surface area, so it has good thermal conductivity. The graphene heat conduction radiator of the present invention has a fast heat conduction and heat dissipation structure, is easy to manufacture, has low cost, and is convenient to use and maintain.

Description

technical field [0001] The invention belongs to the technical field of graphene radiators, and in particular relates to a graphene heat conduction radiator. Background technique [0002] Graphene is a quasi-two-dimensional material with ultra-light, ultra-thin, ultra-strong and ultra-large specific surface area, with a surface density of about 0.77mg / m 2 , the thickness of single-layer graphene is about 0.34nm, the toughness of graphene is excellent, the elastic modulus is 1.0TPa, the microscopic strength can reach 30GPa, which is more than 100 times that of the traditional one, and the theoretical specific surface area is 2630m 2 / g, and has very high electrical and thermal conductivity, and the horizontal thermal conductivity at room temperature is about 5×10 3 W / m·K, so it has been used in the field of radiators, and uses its excellent thermal conductivity to achieve a good heat dissipation effect. Most of the existing graphene heat sinks are formed by coating graphene ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B3/10
CPCH05B3/10
Inventor 陈昌安
Owner 大连东方腾飞建筑装饰工程有限公司
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