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A posterior packaging method of a QFN product

A back-end packaging and product technology, applied in the directions of instruments, character and pattern recognition, electrical components, etc., can solve problems such as easy breakage and lower product yield, to enhance reliability, ensure product yield, and protect flatness effect with roughness

Pending Publication Date: 2018-12-14
星科金朋半导体(江阴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, QFN products are ultra-thin and ultra-large chips, and the injection molding surface is required to be thinner and thinner, which is prone to breakage risks during the packaging process, reducing the yield of finished products

Method used

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  • A posterior packaging method of a QFN product
  • A posterior packaging method of a QFN product
  • A posterior packaging method of a QFN product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0057] The packaging structure of the QFN fingerprint identification chip involved in the present invention, such as figure 2 As shown, the chip 2 is arranged in the middle area of ​​the lead frame 10 and is fixedly connected to the lead frame 10. Specifically, the lead frame 10 includes a chip holder 12, a connecting rib 12, and a gold finger 11, which is a carrier of the chip 2. The chip 2 is fixed to the chip holder 12, and a bonding wire 21 is used to connect the aluminum pads on the chip 2 and the gold fingers 11 one by one. Correspondingly, the golden finger 11 on the remaining side is fixedly connected to the chip holder 12, and the chip 2 is electrically connected to the golden finger 11 to transmit electrical signals to the external PCB board. The chip 2 is a silicon-based fingerprint chip, and in other embodiments, it may also be a chip of other materials or other functions. The plastic package 3 wraps the front surface of the lead frame 10 and the chip 2 and the bon...

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PUM

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Abstract

The invention discloses a posterior packaging method of a QFN product, belonging to the technical field of semiconductor chip packaging. The process comprises the following steps: using a resin bladeis used for semi-cutting the connecting bars of the goldfinger to form pins; performing burr polishing; removing the residual glue of the strip product by the degumming agent; baking in an oven at constant temperature; grinding the injection molding surface to form a grinding surface; pasting a reinforcing film on the abrasive surface; performing tin plating on pin surface; marking on the back ofthe strip product with laser printing; removing the reinforcing film of the grinding surface; cutting the strip product into a plurality of single packages by laser cutting. The invention solves the problem that the packaging product is easy to break in the process, and the step-shaped lead formed by the step-shaped lead enhances the reliability of soldering the packaging product with an externalPCB (printed circuit board).

Description

Technical field [0001] The invention relates to a back-end packaging method for QFN products, in particular to a back-end packaging method for fingerprint identification QFN products that are thinner and thinner, and belongs to the technical field of semiconductor chip packaging. Background technique [0002] Fingerprint recognition technology is a systematic technical system, and the industrial chain involved is relatively complex, involving fingerprint chip manufacturers, fingerprint recognition module manufacturers, fingerprint recognition solution providers, mobile phone terminal manufacturers, and software application vendors. From the chip, packaging, coating, cover, metal ring, and finally to the final module, all links have begun to work hard to break through the bottleneck. [0003] At present, the Substrate package is commonly used in the field of fingerprint identification. The price of fingerprint modules continues to fall. As the price of fingerprint recognition modu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/12H01L2224/48091H01L2924/00014
Inventor 陶军峰李越付雷雷熊辉沈国强刘仁琦
Owner 星科金朋半导体(江阴)有限公司