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Method for accurately measuring thickness of multilayer micro-nano thin film on curved surface

A technology of precise measurement and film thickness, applied in the field of precise measurement of film thickness on cylindrical surface of cylindrical industrial transmission parts, scanning electron beam-focusing ion beam dual-beam system, and accurate measurement of micro-nano film thickness on curved surfaces, which can solve the problem of test accuracy It can achieve the effect of high measurement accuracy, simple and controllable process steps, and reliable results

Active Publication Date: 2018-12-21
陕西华塑包装有限公司
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Problems solved by technology

Although this method is suitable for multi-layer film systems, it can only measure the thickness of the film on a plane, and the test accuracy is not high

Method used

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  • Method for accurately measuring thickness of multilayer micro-nano thin film on curved surface
  • Method for accurately measuring thickness of multilayer micro-nano thin film on curved surface
  • Method for accurately measuring thickness of multilayer micro-nano thin film on curved surface

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Embodiment Construction

[0030] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0031] The scanning electron beam-focused ion beam dual-beam system model that can be used in the present invention is LYRA 3XMH produced by Czech TESCAN company, which is a conventional system of this type of equipment.

[0032] Put the workpiece into the sample chamber of the focused ion beam-scanning electron beam dual-beam system, and use the electron beam imaging unit to find the measurement point where the film thickness needs to be measured (such as figure 1 , inside the circle at the end of the cylindrical transmission).

[0033] According to the guidance of the dual-beam system, adjust the measurement point to the cooperative working point of the electron beam and the focused ion beam, and prepare the gas deposition system.

[0034] First, a layer of SiO with a length and width of 10 μm × 1 μm was pre-deposited at the measurement p...

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Abstract

The invention provides a method for accurately measuring thickness of a multilayer micro-nano thin film on a curved surface. The method is that on a cylindrical industrial transmission part, the crosssection of the thin film is cut out along the direction perpendicular to the thin film by adopting a focused ion beam abrasion cutting technology, and then the cross section morphology of the thin film is observed through an electron microscope, so that the thickness of each layer of the thin film is measured accurately. The process steps of the method are simple and easy to control, and the method is particularly suitable for measuring the thickness of a thin film which is difficult to be completed by a traditional measuring method on a curved surface of a special-shaped workpiece; the measurement can be directly carried out on the workpiece, and the destruction area is less than 10mum magnitude; and the influence on the service performance and the use performance of the workpiece can beignored, thus the method has wide application range and good application prospect in the fields of precision part machining, micro electro mechanical system manufacturing and the like.

Description

technical field [0001] The invention relates to a method for measuring the thickness of a thin film, especially a method for accurately measuring the thickness of a micro-nano thin film on a curved surface. More specifically, it uses a scanning electron beam-focused ion beam dual-beam system to accurately measure cylindrical industrial transmission parts Method for film thickness on cylindrical surfaces. Background technique [0002] Thin films / coatings are widely used in modern precision tool manufacturing and MEMS and play an important role: for example, diamond films have high dielectric constant, compact structure, high hardness, good wear resistance and corrosion resistance, and are used for As dielectric insulating film, passivation protection layer, wear-resistant layer and corrosion resistance layer, etc.; Au film is used as electrode and seed layer, etc.; photoresist film is used for micro-nano pattern transfer and processing; these films The material is an interme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B15/02G01B15/08
CPCG01B15/02G01B15/08
Inventor 刘培植李美芬王博郭俊杰
Owner 陕西华塑包装有限公司
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