Light-emitting device temperature distribution measurement device and measurement method based on micro-hyperspectral

Abstract

The invention discloses a light-emitting device temperature distribution measurement device and measurement method based on microscopy hyper-spectrum, and belongs to the field for testing the light-emitting device temperature distribution. The device comprises a temperature control table, a driving power, a temperature control power, a microscope, a hyper-spectrograph and a computer; the measurement method comprises the following steps: setting initial temperature of a sample, selecting a pulse signal by using the driving power to drive the sample; adjusting the temperature-control power, changing the temperature of the temperature control table, wherein the hyper-spectrograph collects the hyper-spectral data of the sample under the corresponding temperature point; computing a two-dimensional temperature sensitive coefficient matrix according to the hyper-spectral data through the computer; adjusting the driving power to the constant-voltage or constant-current mode, and collecting thehyper-spectral data of the sample by using the hyper-spectrograph; computing centroid wavelength by using the hyper-spectral data under the constant-voltage or constant-current mode through the computer, and obtaining sample surface two-dimensional temperature distribution by combining the two-dimensional temperature sensitive coefficient matrix; obtaining spectrum images of various pixel pointson the surface of the light-emitting device, thereby precisely obtaining the surface two-dimensional temperature distribution diagram of the light-emitting device, and directly reflecting the surfacetemperature change tendency.

Description

technical field [0001] The invention belongs to the field of testing the temperature distribution of light-emitting devices, in particular to a measuring device and method for measuring the temperature distribution of light-emitting devices based on microscopic hyperspectral. Background technique [0002] In the era of energy economy in the 21st century, light-emitting devices such as semiconductor light-emitting diodes (LEDs) are widely used in many fields such as daily life, electronic technology, and military affairs because of their small size, long life, and fast response. LED converts electrical energy into light energy, but since 60% to 70% of electrical energy will be converted into heat energy, if a large amount of heat cannot be dissipated, the junction temperature will be too high, which will seriously affect the service life of LED. Therefore, the research on LED junction temperature has far-reaching significance. [0003] At present, the measurement methods for...

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Problems solved by technology

The infrared thermal imaging method measures the two-dimensional temperature distribution of the surface through the infrared radiation on the surface of the object. The disadvantage is that it is easily affected by the device packaging structure, and it is difficult to detect the surface of the packaged LED chip ([5]Tamdogan E, Pavlidis G, Graham S, et al. .A Comparative Study on the Junction Temperature Measurements of LEDs With Raman Spectroscopy,Microinfrared(IR)Imaging,and Forward Voltage Methods[J].IEEE Transactions on Components Packaging&Manufacturing Technology,2018,PP(99):1-9.)

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