Reusable substrate for additive manufacturing and reusing method

A technology of additive manufacturing and substrates, which is applied in the field of additive manufacturing and reused substrates, can solve problems such as too thin thickness and large deformation, and achieve the effects of easy adjustment, reduced processing area, and improved processing efficiency

Pending Publication Date: 2018-12-25
CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Existing substrate thickness is 15mm (such as figure 1 As shown) the thickness is too thin, and it is easy to produce a large amount of deformation under the action of repeated sandblasting or other external forces or under the condition of laser heating

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reusable substrate for additive manufacturing and reusing method
  • Reusable substrate for additive manufacturing and reusing method
  • Reusable substrate for additive manufacturing and reusing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A reusable substrate for additive manufacturing, comprising a powdered surface of the substrate and a bonding surface of a workbench parallel to each other, the bonding surface of the worktable is provided with three bosses, and counterbores are arranged on the bosses.

[0042] The thickness of the substrate is increased by 50% to 100%, and the thickness of this embodiment is increased by 100%.

Embodiment 2

[0044] Refer to attached Figure 2-5 , a reusable substrate for additive manufacturing. Compared with Embodiment 1, the difference is that there are four bosses, which are respectively arranged at four right angles of the bonding surface of the workbench; the thickness of the substrate 80% increase. The rest of the content is the same as in Embodiment 1. Another embodiment has a 60% increase in the thickness of the substrate.

Embodiment 3

[0046] A reusable substrate for additive manufacturing. Compared with Embodiment 1, the difference is that there are five bosses, which are respectively arranged at four right angles and the center of the bonding surface of the workbench; the substrate The thickness is increased by 50%. The rest of the content is the same as in Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a reusable substrate for additive manufacturing, which comprises a substrate powder laid face and a workbench binding face that are mutually parallel, and is characterized in that the workbench binding face is provided with at least three bosses; and counter holes are formed in the bosses and used for fixed mounting of the substrate and a 3D (three dimensional) printing workbench. A geometric tolerance of the substrate is easier to guarantee; powder laying uniformity and compactness during 3D printing are easier to achieve; the processing difficulty of the substrate isreduced; and the use efficiency of the substrate is improved.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to an additive manufacturing reusable substrate and a reusable method. Background technique [0002] Additive manufacturing technology (also known as "3D printing") is a method of directly manufacturing three-dimensional physical entities in a layer-by-layer manner based on a computer-based three-dimensional CAD model. In view of the superiority of additive manufacturing itself, various targeted 3D printing technologies have emerged, such as: selective laser melting, direct metal fusion deposition, selective curing of photosensitive resin, selective laser sintering, 3D jet printing, etc. In 3D printing methods, the substrate is used as the bottom plate on which the 3D printing workpiece is attached. Therefore, the flatness of the surface of the substrate and the parallelism of the upper and lower surfaces of the substrate have a direct impact on the quality of the 3D...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B22F3/105B24B1/00B33Y30/00
CPCB24B1/00B33Y30/00B22F10/00B22F12/30B22F10/20Y02P10/25
Inventor 颜铁林曹玄扬胡盛青周朝辉
Owner CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products