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Automatic unloading equipment for packaging tubes after packaging semiconductor components

An automatic cutting and packaging tube technology, which is applied in packaging, object stacking, transportation and packaging, etc., can solve the problems of unfavorable people's daily walking and work, occupation of work space, and low efficiency

Active Publication Date: 2020-08-11
江苏尖端半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Semiconductor components need to be transported for short or long distances after production. In order to ensure that the semiconductors are not damaged during transportation, they need to be packed into packaging tubes made of PVC and other materials. Then the packaging tubes are filled with a certain number of semiconductor components. , unloading and stacking are required. The conventional operation is done manually, and the efficiency is very low. However, there are also a few automatic unloading equipment on the market, but these equipment generally stack the packaging tubes horizontally, which will take up a lot of time. The workplace is placed, which is not conducive to people's daily walking and work

Method used

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  • Automatic unloading equipment for packaging tubes after packaging semiconductor components
  • Automatic unloading equipment for packaging tubes after packaging semiconductor components
  • Automatic unloading equipment for packaging tubes after packaging semiconductor components

Examples

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Embodiment Construction

[0038] Below in conjunction with accompanying drawing and embodiment of description, specific embodiment of the present invention is described in further detail:

[0039] refer to Figure 1 to Figure 13The shown automatic unloading equipment for packaging tubes after packaging semiconductor components includes a packaging table 1, a transfer device 2, a reversing device, a feeding device, and a material receiving device 7, and the transfer device 2 is erected above one end of the packaging table 1 , the reversing device is arranged on one side of the packaging table 1, and the transfer device 2 can move toward the direction of the reversing device through the translational electric cylinder 1b. The reversing device includes a supporting plate 3, a servo motor 3a, a clamping assembly and a vertical arrangement The U-shaped seat 3b, the opening of the U-shaped seat 3b is always upward, the middle section of the supporting plate 3 is connected to the opening of the U-shaped seat ...

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Abstract

The invention relates to the field of semiconductor element packaging, in particular to automatic discharging equipment for a packaging tube for packaging semiconductor elements. The automatic discharging equipment comprises a packaging table. The discharging equipment comprises a transferring device, a reversing device, a feeding device and a material receiving device. The transferring device isarranged above one end of the packaging table, the reversing device is arranged on one side of the packaging table, the transferring device can move toward the reversing device through a translationalelectric cylinder, the reversing device comprises a carrying plate, a servo motor, a clamping assembly and a U-shaped base, the middle section of the carrying plate is coupled to the opening of the U-shaped base, the servo motor is arranged on the outer side of the U-shaped base, the clamping assembly is arranged at one end of the carrying plate, an anti-falling assembly is arranged at the otherend of the carrying plate, the material receiving device is arranged next to the end of the carrying plate, the feeding device is arranged at the bottom of the carrying plate, and a proximate air cylinder is arranged next to the U-shaped base. The automatic discharging equipment provided by the invention can discharge the packaging tube filled with semiconductor elements automatically and stack the semiconductor elements in a vertical gesture, so that the occupied area is further saved.

Description

technical field [0001] The invention relates to the field of packaging of semiconductor components, in particular to an automatic unloading device for packaging tubes after semiconductor components are packaged. Background technique [0002] A semiconductor component is an electronic component whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor of semiconductor components The material is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. [0003] Semiconductor components need to be transported for short or long distances after production. In order to ensure that the semiconductors are not damaged during transportation, they need to be packed in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B61/22B65B61/28B65G47/24B65G47/82B65G57/00
CPCB65B61/22B65B61/28B65G47/24B65G47/82B65G57/00B65G2201/0276
Inventor 史彦文王茜卞杰锋
Owner 江苏尖端半导体有限公司
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