An ultra-small high-sensitivity two-dimensional anemometer and its manufacturing method

Abstract

An ultra-small high-sensitivity two-dimensional anemometer, comprising: a base (1), an insulation dielectric layer (2), a square frustum (3), a heating element (4), and four temperature-measuring thermocouple piles (51). The invention provides an ultra-small high-sensitivity two-dimensional anemometer and a corresponding manufacturing method for the ultra-small high-sensitivity two-dimensional anemometer, and has the following advantages: 1) the frustum structure creates a height difference between a measurement plane and a plane where a welding lead is located, thereby facilitating packaging of a sensor; 2) the thermocouple of the sensor is placed approximately vertically, and a cold end thereof is sealed by an encapsulation adhesive and kept at the same temperature as the base and an outer casing, thereby effectively ensuring temperature uniformity of the cold end and causing the sensor to have good resistance to temperature drift; 3) the frustum structure greatly reduces the lateral dimension of the thermocouple and decreases the size of the device; and 4) a high-sensitivity surface of the sensor is closely attached to the outer casing with no encapsulation adhesive exposed to the air, thereby improving reliability of the sensor.

Description

technical field [0001] The invention relates to an ultra-small high-sensitivity two-dimensional anemometer and a manufacturing method thereof, belonging to the technical field of wind speed detection. Background technique [0002] Wind speed and wind direction are very important parameters to reflect meteorological conditions, and have an important impact on environmental monitoring, air conditioning, and industrial and agricultural production. Therefore, it is of great practical significance to quickly and accurately measure wind speed and wind direction. As we all know, although wind cups and wind vanes that are machined can also measure wind speed and wind direction, these mechanical devices are easy to wear due to moving parts, and have the disadvantages of large volume, high price, and frequent maintenance. The positions of the transmitting and detecting receiving heads of a typical ultrasonic wind speed sensor are fixed, so the relative structure is relatively large. ...

AI Technical Summary

Problems solved by technology

However, due to the high thermal conductivity of the silicon substrate, this type of sensor consumes a lot of power and has low sensitivity

Using the method of back etching or front etching to form a thermal insulation film can improve the sensitivity, but the structure is easily damaged, which is not conducive to the subsequent process and packaging

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