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Light-emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that the luminous efficiency needs to be further improved, and achieve the effect of high phosphor excitation efficiency

Active Publication Date: 2020-09-22
KAISTAR LIGHTING (XIAMEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the brightness and luminous efficiency of the existing lighting devices manufactured by using light-emitting diodes still need to be further improved.

Method used

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  • Light-emitting diode packaging structure
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  • Light-emitting diode packaging structure

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Experimental program
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Embodiment Construction

[0013] Please refer to figure 1 . figure 1 It is a schematic top view of an LED packaging structure according to one embodiment of the present invention. In the embodiment of the present invention, high-brightness white light is mixed by using light beams generated by non-secondarily excited light-emitting units.

[0014] Such as figure 1 As shown, the LED packaging structure M1 includes a substrate 10 and a light emitting unit array 11 . A die-bonding region 100 is defined on one surface of the substrate 10 . The substrate 10 may be a substrate with high thermal conductivity, such as a ceramic substrate or a metal substrate. The light-emitting unit array 11 is disposed on the substrate 10 and located in the die-bonding area 100 .

[0015] In this embodiment, the LED packaging structure M1 further includes an anode pad 12 and a cathode pad 13 . Both the positive electrode pad 12 and the negative electrode pad 13 are disposed on the substrate 10 .

[0016] The plurality ...

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Abstract

The invention discloses a light emitting diode packaging structure. The structure includes a substrate and a light-emitting unit array; the substrate has a crystal-bonding area, and the light-emitting unit array is placed in the crystal-bonding area; the light-emitting unit array includes a plurality of non-secondary-excited first light-emitting units that generate the first light beam and generate the second light beam A plurality of non-secondary excitation second light-emitting units, the first light beam and the second light beam are mixed with each other to generate white light; each first light-emitting unit includes a first light-emitting chip and a first wavelength conversion covering the first light-emitting chip layer, each second light-emitting unit includes a second light-emitting chip and a second wavelength conversion layer covering the second light-emitting chip, the first light beam contains the first excited light generated by exciting the first wavelength conversion layer, and the second light beam contains Exciting the second excited light generated by the second wavelength conversion layer, the difference between the peak wavelengths of the first and second excited light is at least 30 nm. The light emitting diode package structure of the present invention can generate white light with high color rendering index and high brightness.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure, in particular to a light emitting diode packaging structure capable of improving brightness. Background technique [0002] A light-emitting diode (LED for short) is a semiconductor electronic device that can convert electrical energy into light energy. Light-emitting diodes are widely used in displays or lighting devices due to their high brightness, low power consumption, long lifespan, fast start-up, high luminous efficiency, no flicker, and low viewing angle fatigue. [0003] In the field of lighting, white light is the most commonly used light source color. Therefore, blue light-emitting diodes are often used in combination with yellow or other mixed phosphors to generate white light. However, the brightness and luminous efficiency of the existing lighting devices manufactured by using light-emitting diodes still need to be further improved. Contents of the invention [0004]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/50
CPCH01L25/0753H01L33/502H01L33/54H01L33/62H01L33/504H01L33/50H01L33/505H01L33/52
Inventor 张景琼林宗杰
Owner KAISTAR LIGHTING (XIAMEN) CO LTD