Light-emitting diode packaging structure
A technology of light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that the luminous efficiency needs to be further improved, and achieve the effect of high phosphor excitation efficiency
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[0013] Please refer to figure 1 . figure 1 It is a schematic top view of an LED packaging structure according to one embodiment of the present invention. In the embodiment of the present invention, high-brightness white light is mixed by using light beams generated by non-secondarily excited light-emitting units.
[0014] Such as figure 1 As shown, the LED packaging structure M1 includes a substrate 10 and a light emitting unit array 11 . A die-bonding region 100 is defined on one surface of the substrate 10 . The substrate 10 may be a substrate with high thermal conductivity, such as a ceramic substrate or a metal substrate. The light-emitting unit array 11 is disposed on the substrate 10 and located in the die-bonding area 100 .
[0015] In this embodiment, the LED packaging structure M1 further includes an anode pad 12 and a cathode pad 13 . Both the positive electrode pad 12 and the negative electrode pad 13 are disposed on the substrate 10 .
[0016] The plurality ...
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