A packaging support structure and a light emitting device including the packaging support mechanism

A technology for encapsulating brackets and light-emitting devices, which is applied in the field of light-emitting, and can solve problems such as the failure of LED brightness to meet expectations and affect LED light-emitting efficiency, and achieve the effects of reducing loading errors and preventing breakage or deformation

Inactive Publication Date: 2020-09-25
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] On the other hand, the heat energy generated by LED operation often affects the luminous efficiency of LEDs, making the brightness of LEDs fail to meet expectations

Method used

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  • A packaging support structure and a light emitting device including the packaging support mechanism
  • A packaging support structure and a light emitting device including the packaging support mechanism
  • A packaging support structure and a light emitting device including the packaging support mechanism

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Experimental program
Comparison scheme
Effect test

Embodiment 2

[0066] Figure 5 is a schematic structural view of the light-emitting device provided in Embodiment 2 of the present invention, Figures 6A-6B It is a structural schematic diagram when the substrate has a supporting mechanism in the light-emitting device provided by Embodiment 2 of the present invention, Figure 7A It is a schematic structural view of the quantum dot material and the phosphor material in the encapsulating colloid in the light-emitting device provided by Embodiment 2 of the present invention after being inverted and centrifuged, Figure 7B It is a schematic diagram of the structure when the quantum dot material and phosphor material in the encapsulation colloid are uniformly distributed, Figure 7C It is a schematic diagram of the structure when the quantum dot material and phosphor material are distributed in layers in the encapsulation colloid.

[0067] The above-mentioned embodiment is an explanation of the technical content of the package support structur...

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PUM

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Abstract

The present invention provides a packaging support structure and a light-emitting device comprising the packaging support structure. The packaging support structure includes: a casing, the casing includes a light-emitting surface, a backlight surface, a bottom surface and a groove, and A conductive bracket, the conductive bracket is partially covered by the housing, and the conductive bracket includes a first pin and a second pin separated from each other, the first pin and the second pin Each lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the electrode portion of the bent portion extends outward to the outside of the housing and toward The bottom surface of the housing is bent; one of the first pin and the second pin further includes a heat dissipation part, and the heat dissipation part extends outward from the electrode part and extends from the The backlight surface of the casing is exposed, and the packaging support structure provided by this embodiment achieves the effect of reducing the error of the upper part and effectively removing heat energy.

Description

technical field [0001] The invention relates to the field of light emission, in particular to a package support structure and a light emitting device including the package support mechanism. Background technique [0002] More and more displays equipped with current electronic products use light-emitting diodes (LEDs) as light-emitting elements, and the light emitted by the LEDs can be evenly emitted from the panel of the display through components such as light guide plates. More specifically, the LED is first arranged in a packaging structure, and then the packaging structure is arranged on a substrate, and the light incident surface of the light guide plate is aligned with the LED, so that the light emitted by the LED enters into the guide as much as possible. Light parts to reduce the occurrence of light leakage. Therefore, if the alignment between the LED and the light guide is inaccurate, it will cause light leakage, which will lead to problems such as poor display eff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L23/31
CPCH01L33/48H01L33/62H01L33/647G02B6/009G02B6/4269H01L33/486H01L33/642G02B6/0073H01L33/507H01L33/508H01L33/644
Inventor 刘建男陈登暐康桀侑杨皓宇李昱达
Owner EVERLIGHT ELECTRONICS
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