Plating system and plating glass manufacturing method

A coating system and coating glass technology, applied in the field of glass manufacturing, can solve the problems of poor film thickness uniformity of coated glass and the like

Active Publication Date: 2019-01-08
WGTECH JIANGXI
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Problems solved by technology

[0006] The above-mentioned coating system, since the magnetic field device includes a first magnetic field device and a second magnetic field device, the first magnetic field device, the substrate table, the sputtering target table, and the second magnetic field device are located in the area where the electric field device generates an electric field, and along the The direction of the electric field generated by the electric field device i

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  • Plating system and plating glass manufacturing method
  • Plating system and plating glass manufacturing method
  • Plating system and plating glass manufacturing method

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Embodiment Construction

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicatin...

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Abstract

The invention relates to a plating system and a plating glass manufacturing method. The plating system comprises a vacuum chamber, a sputtering target, a substrate platform, an electric field device and a magnetic field device, wherein the sputtering target, the substrate platform, the electric field device and the magnetic field device are arranged in the vacuum chamber; the magnetic field devicecomprises a first magnetic field device and a second magnetic field device; the first magnetic field device, the substrate platform, the sputtering target and the second magnetic field device are positioned in an area of an electric field generated by the electric field device and are arranged in sequence in a direction of the electric field generated by the electric field device; the first magnetic field device is positioned inside an area with thin predicted plating thickness, and is right aligned to a glass substrate to be plated on a corresponding substrate platform. When plating is carried out, the plating quantity of the area with the thin predicted plating thickness can be intensified by using the first magnetic field device, and plated glass with good uniformity can be manufactured.

Description

technical field [0001] The invention relates to the field of glass manufacturing, in particular to a coating system and a method for manufacturing coated glass. Background technique [0002] At present, coated glass is divided into three categories according to the different characteristics of the product: heat reflective glass, low-emissivity glass and conductive film glass. Among them, conductive film glass has been widely used in liquid crystal displays, solar cells, optoelectronics and various optical fields due to its advantages of low resistance and good conductivity. [0003] However, in the manufacturing process of conductive film glass, there will be uneven film thickness. Among them, during the coating process of conductive materials such as Nano Indium tin oxide (ITO) or antimony tin oxide (Antimony Tin Oxide, ATO), the resistance of the corners will be greater than that of the middle position, affecting The uniformity of the entire product; in the coating proce...

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Application Information

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IPC IPC(8): C23C14/02C23C14/08C23C14/35
CPCC23C14/02C23C14/086C23C14/351
Inventor 张迅易伟华郑芳平周慧蓉
Owner WGTECH JIANGXI
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