The present invention provides a new copperplate board coating. The copperplate board coating comprises the following raw materials, by weight, 5-100 parts of a pigment, 0-20 parts of starch, 0.2-5 parts of caustic soda, 0.05-3 parts of a rheology and water retaining agent, 1-30 parts of latex, 0.1-10 parts of a hydration resistant agent, 0.1-10 parts of a water repellent agent, 0.1-10 parts of alubricant and 0.1 to 8 parts of a dispersing agent. With the formula of the high solid content coating provided by the present invention, the gram weight of the base paper can be reduced in the context of production of the copper board with the same specification, such that the ratio of the base paper in the copper board is reduced, the slurry cost is decreased, the requirement of wood is reduced, the economic benefits and the social benefits are significantly improved; due to the reduction of the gram weight of the base paper, the speed can be improved during the base paper papermaking, the machine efficiency and the productivity can be improved; with the improvement of the coating amount, the paper covering and the smoothness are improved, such that the final product has a better printing effect.