Metallized ceramic substrate and preparation method thereof

Abstract

The invention discloses a metallized ceramic substrate and a preparation method thereof. The metalized ceramic substrate is prepared according to the following steps: (1) preparing an aluminum nitrideceramic substrate; and (2) forming a silver layer on the surface of the aluminum nitride ceramic substrate; (3) forming an organic layer on the silver layer away from the surface of the aluminum nitride ceramic substrate; (4) forming a copper paste layer on the organic layer away from the surface of the silver layer so as to form a metallized ceramic substrate precursor; and (5) sintering the metallized ceramic substrate precursor under vacuum. When in vacuum sintering, the temperature of the vacuum sintering is relatively high, and the silver layer diffuses into the aluminum nitride ceramicsubstrate to react with aluminum nitride to form a silver nitride transition layer to improve the bonding force; during the process of the vacuum sintering, the silver layer does not react with the copper paste layer due to the isolation of the organic layer, and the silver layer is prevented from migrating to the copper paste layer; the metallized ceramic substrate prepared by the invention has high conductivity and good plating adhesion. At the same time, the metallized ceramic substrate prepared by the invention has excellent heat cycle resistance.

Description

technical field [0001] The invention relates to the technical field of ceramic metallization, in particular to a method for preparing a metallized ceramic substrate and the prepared metallized ceramic substrate. Background technique [0002] Ceramic materials are indispensable materials in people's life, modern industry and aerospace fields. In practical applications, ceramic materials have been widely used for their unique high temperature resistance, wear resistance and thermal shock resistance. At present, countries all over the world are Vigorously research and develop ceramic materials. However, the hard and brittle properties of ceramic materials make the processing performance of ceramic materials poor, and they need to be combined with other materials in practical applications to be used. [0003] Ceramic surface metallization can connect ceramics and metals to form a composite substrate, which combines the excellent mechanical properties of ceramic materials with t...

AI Technical Summary

Problems solved by technology

[0005] Metallization methods for ceramic substrates in the prior art include thin-film method and thick-film method. The through-hole compactness of the substrate manufactured by the thin-film method is poor, and the bonding force between the metal layer and ceramics is low; the metal layer of the substrate manufactured by the thick-film method has Low electrical conductivity, poor plating adhesion

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