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A preparation method of silver-gold alloy bonding wire with high strength and toughness and low resistivity

A low-resistivity, silver-gold alloy technology, applied in the field of alloys, can solve the problems of low strength and high price, achieve the effect of improving the yield, reducing volatilization loss, and ensuring uniformity and consistency

Active Publication Date: 2020-07-07
CHONGQING MATERIALS RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, gold has the disadvantages of high price, low strength, and brittle intermetallic compounds at the interface with aluminum disks. In order to improve the performance of bonding wires and reduce production costs, relevant institutions in various countries have developed alternative new gold-silver-based alloy bonding wires. Extensive research and application development make it an ideal material to replace gold wire

Method used

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  • A preparation method of silver-gold alloy bonding wire with high strength and toughness and low resistivity

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1: Ag content is 99.4%, Ce content is 0.005%, Cu content is 0.001%, and the rest is Au;

Embodiment 2

[0034] Example 2: Ag content is 85%, Ce content is 0.01%, Cu content is 0.05%, Pd content is 0.01%, Ca content is 0.0005%, and the rest is Au;

Embodiment 3

[0035] Embodiment 3: the Ag content is 95%, the Ce content is 0.005%, the Cu content is 0.005%, the Be content is 0.005%, and the rest is Au;

[0036] The above-mentioned gold purity is ≥99.995% high-purity gold, the silver purity is ≥99.999% high-purity silver, and the purity of other elements is ≥99.99%.

[0037] Get each component described in embodiment 1-3, prepare the silver-gold alloy bonding wire of high strength toughness, low resistivity respectively according to the following method:

[0038] 1) High vacuum medium frequency induction melting:

[0039] Put Au and part of Ag (the amount of Ag is not more than half of the total amount of Ag) in a high-vacuum medium-frequency melting furnace for master alloy melting, the melting temperature is 1100-1300 ° C, and the melting process is filled with high-purity Protected by argon gas, after refining and cooling for 10-30 minutes, alloy ingots are obtained; processed into Ag / Au master alloy plates, cleaned and ready for us...

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Abstract

The invention relates to a preparation method for a high-toughness low-resistivity silver-gold alloy bonding wire. According to the silver-gold alloy bonding wire prepared by adopting the method, thefracturing load is greater than 10 cN, meanwhile, the elongation percentage is greater than 18 percent, the mechanical properties are adjustable and controllable, and the resistivity is lower than 1.8mu omega.cm. The using cost of the silver-gold alloy bonding wire prepared by adopting the method provided by the invention is reduced by over 80 percent compared with the material cost of the existing gold bonding wire; moreover, the mechanical properties, the electrical properties, the oxidization resistance and the bonding performance are excellent, so that the silver-gold alloy bonding wire can be widely applied to the field of packaging.

Description

technical field [0001] The invention belongs to the field of alloys, in particular to a method for preparing a silver-gold alloy bonding wire with high strength and toughness and low resistivity. Background technique [0002] With the upgrading of advanced semiconductor packaging technology and the development of new electronic industries, bonding wire, one of the key basic materials for electronic packaging, requires miniaturization, high strength, and low cost, and at the same time meets the requirements of stable lead arc in the bonding process of integrated circuits. , high bonding fastness and high stability, excellent electrical conductivity and other comprehensive performance requirements. The resistivity of high-purity silver is 1.6μΩ•cm, the smallest resistivity among all metals, the best conductivity, and the heat dissipation of silver is better than that of gold, but pure silver wire is unstable in ball formation and easy to oxidize, so there is a big problem in i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C1/03C22F1/14C22F1/02H01L23/49
CPCC22C1/03C22C5/06C22F1/02C22F1/14H01L23/49H01L2224/48463
Inventor 唐会毅吴保安郭卫民罗维凡刘庆宾李凤罗凤兰陈小军
Owner CHONGQING MATERIALS RES INST
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