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Polyimide flexible flat heat pipe

A polyimide flexible, flat heat pipe technology, applied in the field of heat transfer, can solve the problems of poor flexibility of metal materials and difficulty in adapting to the heat dissipation requirements of curved surfaces, and achieve the effects of avoiding burning out, increasing the maximum heat dissipation power, and reducing the thickness

Inactive Publication Date: 2019-01-22
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the use of metal as the shell material has the advantages of low thermal resistance and easy packaging, but the flexibility of metal materials is poor, and it is difficult to meet the heat dissipation requirements of curved surface electronics, especially flexible electronics.

Method used

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  • Polyimide flexible flat heat pipe
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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0025] like Figure 1-5 As shown, the copper column array of the present invention has two types, the array with lower height and smaller diameter arranged in a rectangle, that is, the micro-copper column array 6 as a capillary structure; the array with a higher height and a larger diameter arranged in a rectangle, that is, support The copper column array 5 serves as a space support to provide steam channels.

[0026] Wherein, the liquid-absorbing core of the present invention is a composite structure of microcopper column array 6 and copper grid 2, microcopper column array 6 is closely connected with the upper surface of lower shell plate 3, and copper grid 2 is closely connected with microcopper column array 6. Connected and run through the supporting copper column array 5, the supporting copper column array 5 is arranged between each array of the micro co...

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Abstract

The invention discloses a polyimide flexible flat heat pipe. The polyimide flexible flat heat pipe comprises an upper shell plate, a lower shell plate, a liquid absorbing core and a liquid filling pipe. The upper shell plate and the lower shell plate are both made of flexible polymer polyimide, wherein a micro-nano structure with the super-hydrophobic surface is arranged on the lower surface of the upper shell plate, a copper net and micro copper column array composite structure is adopted for the liquid absorbing core, and a steam channel is formed by a supporting copper column array arrangedbetween the upper shell plate and the lower shell plate. The polyimide flexible flat heat pipe has the advantages of being small in thickness and high in flexibility, is suitable for heat dissipationof flexible or curved electronic components, and has extremely high surface adaptability.

Description

technical field [0001] The invention relates to a polyimide flexible flat heat pipe, which belongs to the technical field of heat transfer. Background technique [0002] With the performance improvement and size reduction of modern electronic products, the power density is getting higher and higher, resulting in more and more serious heat dissipation problems. Although the use of metal as the housing material has the advantages of low thermal resistance and easy packaging, but the flexibility of metal materials is poor, and it is difficult to meet the heat dissipation requirements of curved surface electronics, especially flexible electronics. Therefore, how to solve the heat dissipation problem of flexible electronics and curved surface electronics has become a key technology. Contents of the invention [0003] In order to solve the problems existing in the prior art, an object of the present invention is to provide a polyimide flexible flat heat pipe, which uses polymer...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04F28F9/00H05K7/20
CPCF28D15/0241F28D15/046F28F9/001F28F2245/02H05K7/20
Inventor 张平燕立培史波许晖李娇何虹
Owner GUILIN UNIV OF ELECTRONIC TECH
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