Impulse high-speed jet impacting board material connecting method and device

Abstract

The invention relates to an impulse high-speed jet impacting board material connecting device, and belongs to the technical field of thin board connection. The device comprises a control system, a high-pressure water pump, an impulse loading device, a joint robot, a spraying nozzle, a mold, a workbench and a forming cavity; the control system, the high-pressure water pump and the joint robot are successively connected, the impulse loading device is installed in the joint robot, and the high-pressure water pump is communicated with a water source at the position close to the work end of the joint robot; the control system is connected with the joint robot, the work end of the joint robot is communicated with the spraying nozzle, and the control system controls the work end of the joint robot to control the motion trace and angle of the spaying nozzle; a forming mold is installed on the workbench. Impulse high-speed jet flow can significantly improve the forming capacity of board materials, friction force generated in the forming process is reduced, and therefore distribution of the thickness of a deformed part is more uniform.

Description

technical field [0001] The invention relates to the technical field of thin plate connection, in particular to a plate connection method and device based on pulsating high-speed jet impact. Background technique [0002] Material connection technology is one of the widely used technologies in the field of mechanical manufacturing. According to the basic principle of connection realization, it can be divided into mechanical connection and physical and chemical connection. Common mechanical connection methods include bolt connection, screw connection, rivet connection, key connection, pin connection, etc. Common physical and chemical connection methods include adhesive bonding, welding, sealing, etc. The difference between mechanical connection and physical and chemical connection lies in the realization of the connection. Whether changes in physical state (such as solid-liquid phase transition) and chemical properties occur in the main process. Each of these connection techno...

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Problems solved by technology

[0003] 1. The thermal effect of the welding method is too obvious, which may easily cause defects such as plate burn-through, material structure change, and thermal deformation.

[0004] 2. The bolt connection or rivet connection method will destroy the integrity and sealing of the material, and it is easy to cause uneven force on the connection part, thus causing damage at the connection position

[0005] 3. The connection area formed by the bonding method is usually not resistant to high temperature and the connection strength is low

[0006] 4. Regardless of welding or bolting, the material properties of welds or bolts are usually different from those of the connected object, so electrochemical corrosion is prone to occur at the joint

Therefore, the progressive laser shock continuous riveting device is more complicated

(3) The metal plate cold-press deformation connection method has many process steps, the processing of the connection end is cumbersome, and it belongs to point connection, so it is difficult to realize continuous line connection

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