Heat dissipation device and laser module for semiconductor laser

Abstract

The invention provides a heat dissipation device for a semiconductor laser and a laser module using the heat dissipation device, the heat dissipation device comprises a heat dissipation base, the heatdissipation base is an integral heat sink with a layered structure, comprises a bottom-up mechanical assembly layer, a buffer layer, an inlet liquid layer, a separation layer, an outlet liquid layerand a heat dissipation layer, wherein the cooling liquid firstly cools the heat crosstalk seriously and the middle part with high junction temperature and then cools the two sides of the chip with lowjunction temperature after the temperature rises, thereby improving the junction temperature uniformity of each laser chip of the horizontal semiconductor laser array.

Description

technical field [0001] The invention belongs to the field of semiconductor device packaging, in particular to a heat dissipation device for semiconductor lasers and a laser module using the heat dissipation device. Background technique [0002] Horizontal array semiconductor lasers are widely used in the fields of pumping and industrial processing. This structure is a horizontal array high-power semiconductor laser disclosed in patent CN201520603725.X. Generally, several laser bar chips are arranged horizontally in sequence, so that the emitted laser is a linear flare. The semiconductor laser bar chip is composed of multiple light-emitting points. When QCW long pulse width or CW high-power output is performed, the thermal crosstalk between the light-emitting points is very obvious, resulting in inconsistent junction temperatures of different light-emitting points, generally the junction temperature of the middle area of ​​the chip Higher than the junction temperature on bot...

AI Technical Summary

Problems solved by technology

The semiconductor laser bar chip is composed of multiple light-emitting points. When QCW long pulse width or CW high-power output is performed, the thermal crosstalk between the light-emitting points is very obvious, resulting in inconsistent junction temperatures of different light-emitting points, generally the junction temperature of the middle area of ​​the chip Higher than the junction temperature on both sides of the chip; For horizontal array semiconductor lasers, the thermal crosstalk between different chips is more obvious, especially for chips located in the middle of the horizontal array, the junction temperature is significantly higher than that on both sides, and different junction temperatures will cause The following problems: 1) The service life of each light-emitting point or chip is different; 2) Thermal stress is generated inside the chip, resulting in a decrease in parameters such as polarization; 3) The output power and central wavelength of each light-emitting point or chip are different, resulting in the overall failure of the chip or array product. The spectrum is very wide, which has great limitations on the application range

[0003] At present, the main ways to solve the inconsistent chip junction temperature are: (1) Use a microchannel structure with smaller channels for a single chip to improve the overall heat dissipation capacity of the chip or array to reduce the junction temperature difference. This method will lead to microchannel and heat sink processing. (2) Adjust the size or structure of the cooling channel at different positions of the chip or array product, so that the pressure drop of each channel can be controlled to achieve uniformity of heat dissipation. This method has very strict requirements on the shape of the water inlet channel. Now It is difficult to achieve the result required by the design with processing ability

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