Unlock instant, AI-driven research and patent intelligence for your innovation.

Solder composition, electronic substrate and method for manufacturing electronic substrate

A technology for electronic substrates and compositions, applied in manufacturing tools, welding/cutting media/materials, welding equipment, etc., can solve the problems of reducing large-diameter pores, huge pores, and deficiencies, and achieve the effect of inhibiting the adhesion of scrapers

Active Publication Date: 2021-09-07
TAMURA KK
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that even if such a solvent with a high boiling point and high viscosity is used, the effect of reducing large-diameter pores is not sufficient for an electronic component such as a power transistor with a large electrode terminal area.
It is also known that electronic substrates are sometimes subjected to multiple reflow processes, but the pores may be further enlarged by repeated reflow processes.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Solder composition, electronic substrate and method for manufacturing electronic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] Rosin-based resin A 15 mass%, rosin-based resin B 23.7 mass%, organic acid A 0.3 mass%, organic acid B 0.3 mass%, activator 1 mass%, solvent A 13.6 mass%, solvent C 10.8 mass%, solvent 24% by mass of D, 4.8% by mass of thixotropic agent A, and 6.5% by mass of thixotropic agent B were put into a container, and mixed using a planetary mixer to obtain a flux composition.

[0100] Then, 10.2% by mass of the obtained flux composition and 89.8% by mass of the solder powder (100% by mass in total) were put into a container and mixed using a planetary mixer to prepare a solder composition.

Embodiment 2～5

[0102] A solder composition was obtained in the same manner as in Example 1 except that various materials were blended according to the composition shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
acid valueaaaaaaaaaa
areaaaaaaaaaaa
Login to View More

Abstract

The present invention provides a solder composition comprising: (A) rosin resin, (B) activator, (C) solvent, and (D) solder powder, and (E) solder powder. The variable agent, the (A) component contains (A1) a rosin-based resin with an acid value of 200 mgKOH / g or more, and (A2) a rosin-based resin with an acid value of less than 200 mgKOH / g, and the (B) component contains (B1) An organic acid, wherein the (C) component contains: (C1) at least one selected from isobornylcyclohexanol and diisopropyl sebacate, (C2) a solvent having a boiling point of 245° C. or lower, and (C3 ) Tetraethylene glycol dimethyl ether.

Description

technical field [0001] The present invention relates to a solder composition, an electronic substrate and a method for manufacturing the electronic substrate. Background technique [0002] The solder composition is a paste-like mixture obtained by kneading a flux composition (rosin-based resin, activator, solvent, etc.) with solder powder (for example, Document 1 (Japanese Patent No. 5756067)). In this solder composition, not only solderability such as solder meltability and property of solder being easy to wet and spread (solder wetting and spreading), but also suppression of voids, printability, and the like are required. [0003] On the other hand, large electronic components have been mounted on electronic substrates through the diversification of functions of electronic devices. In addition, among large electronic components, there are electronic components having a large electrode terminal area (for example, power transistors). In such an electronic component, since ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 出水亮大年洋司
Owner TAMURA KK