LED chip silicone die bond adhesive

An LED chip, silicone technology, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of yellowing, poor high-temperature adhesion of silicone solid-state adhesives, and incomplete cross-linking, etc. Improve high temperature hardness and strength, enhance high temperature adhesion of resin, and enhance the effect of skeleton structure

Inactive Publication Date: 2019-02-01
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the crystal-bonding glue of LED lamps is mainly silicone. The main reason is that the silicone crystal-bonding glue has good anti-high temperature yellowing performance, and the LED light flux changes little under high temperature for a long time, but Silicone die-bonding glue has poor high-temperature adhesion, which seriously affects its application
As we all know, the colloidal adhesiveness is related to the content of its hydroxyl group, and the curing of silicone solidification adhesive is generally catalyzed by Pt catalyst at high temperature to promote the self-polymerization and crosslinking of Si-H and vinyl, and the hydroxyl group can be combined with Si -H reacts and polymerizes quickly at room temperature, so the hydroxyl content in silicone die-bonding adhesives is generally not too high, which leads to poor bonding performance of silicone die-bonding adhesives
On the other hand, the silicone crystal-b

Method used

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  • LED chip silicone die bond adhesive
  • LED chip silicone die bond adhesive
  • LED chip silicone die bond adhesive

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] The preparation steps of the silicone solid crystal glue are as follows: 30 parts of MT type silicone resin (molecular weight 3000), 50 parts of MQ type silicone resin (molecular weight 5000) and 5 parts of crosslinking agent (where x = 18). Pre-mix at 80°C, then add 0.1 part of catalyst, and pre-mix again at 80°C. After mixing, cool to room temperature, add 5 parts of special filler, 0.3 part of inhibitor dibutyl maleate, and silicone oil in sequence (Wherein n=10) 15 parts, adhesive (molecular weight: 1500) 2 parts, slowly stirred and mixed at room temperature, and mixed uniformly to obtain the organic silicon solid crystal glue.

Example Embodiment

[0028] Example 2

[0029] The preparation steps of the silicone solid crystal glue are as follows: 50 parts of MT type silicone resin (molecular weight 3000), 30 parts of MQ type silicone resin (molecular weight 5000) and 5 parts of crosslinking agent (where x=18). Pre-mix at 80°C, then add 0.1 part of catalyst, and pre-mix again at 80°C. After mixing, cool to room temperature, add 5 parts of special filler, 0.3 part of inhibitor dibutyl maleate, and silicone oil in sequence (Wherein n=10) 15 parts, adhesive (molecular weight: 1500) 2 parts, slowly stirred and mixed at room temperature, and mixed uniformly to obtain the organic silicon solid crystal glue.

Example Embodiment

[0030] Example 3

[0031] The preparation steps of the silicone solid crystal glue are as follows: 40 parts of MT type silicone resin (molecular weight 3000), 40 parts of MQ type silicone resin (molecular weight 5000) and 5 parts of crosslinking agent (where x=18). Pre-mix at 80°C, then add 0.1 part of catalyst, and pre-mix again at 80°C. After mixing, cool to room temperature, add 5 parts of special filler, 0.3 part of inhibitor dibutyl maleate, and silicone oil in sequence (Wherein n=10) 15 parts, adhesive (molecular weight 1500) 2 parts, slowly stirred and mixed at room temperature, and mixed uniformly to obtain the silicone solid crystal glue.

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Abstract

An LED chip silicone die bond adhesive comprises, by weight, 20-40 parts of MT type silicone resin, 20-40 parts of MQ type silicone resin, 15-45 parts of silicone oil, 5-10 parts of a crosslinking agent, 2-10 parts of a special filler, 0.1-0.5 part of a catalyst, 1-10 parts of a binder and 0.3-0.6 part of an inhibitor. The silicone die bond adhesive prepared in the invention has the advantages ofconsideration of the hydroxyl content in the adhesive, good high-temperature bonding performance, control of the content of a Pt-based catalyst, ensuring of the catalytic degree of Si-H and vinyl groups in the silicone die bond adhesive, and ensuring of the high-temperature yellowing resistance.

Description

technical field [0001] The invention relates to an organic silicon crystal-bonding adhesive for LED chips and a preparation process thereof, in particular to an organic silicon crystal-bonding adhesive for LED chips with excellent high-temperature bonding performance and good high-temperature yellowing resistance, and belongs to the technical field of adhesives. technical background [0002] At present, LED lights emit light through chips, which have lower energy consumption and longer service life than commonly used incandescent or fluorescent lamps, and can be produced by intelligent and assembly line control, with huge production capacity and low cost, so this industry has a very broad application market , Refusing to complete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office. [0003] At present, in the intelligent...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/08
CPCC08L2203/206C08L2205/025C08L2205/035C09J11/08C09J183/04C08L83/04C08L83/08
Inventor 李龙陈维
Owner YANTAI DARBOND TECH
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