LED chip silicone die bond adhesive

Abstract

An LED chip silicone die bond adhesive comprises, by weight, 20-40 parts of MT type silicone resin, 20-40 parts of MQ type silicone resin, 15-45 parts of silicone oil, 5-10 parts of a crosslinking agent, 2-10 parts of a special filler, 0.1-0.5 part of a catalyst, 1-10 parts of a binder and 0.3-0.6 part of an inhibitor. The silicone die bond adhesive prepared in the invention has the advantages ofconsideration of the hydroxyl content in the adhesive, good high-temperature bonding performance, control of the content of a Pt-based catalyst, ensuring of the catalytic degree of Si-H and vinyl groups in the silicone die bond adhesive, and ensuring of the high-temperature yellowing resistance.

Description

technical field [0001] The invention relates to an organic silicon crystal-bonding adhesive for LED chips and a preparation process thereof, in particular to an organic silicon crystal-bonding adhesive for LED chips with excellent high-temperature bonding performance and good high-temperature yellowing resistance, and belongs to the technical field of adhesives. technical background [0002] At present, LED lights emit light through chips, which have lower energy consumption and longer service life than commonly used incandescent or fluorescent lamps, and can be produced by intelligent and assembly line control, with huge production capacity and low cost, so this industry has a very broad application market , Refusing to complete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office. [0003] At present, in the intelligent...

AI Technical Summary

Problems solved by technology

[0005] At present, the crystal-bonding glue of LED lamps is mainly silicone. The main reason is that the silicone crystal-bonding glue has good anti-high temperature yellowing performance, and the LED light flux changes little under high temperature for a long time, but Silicone die-bonding glue has poor high-temperature adhesion, which seriously affects its application

As we all know, the colloidal adhesiveness is related to the content of its hydroxyl group, and the curing of silicone solidification adhesive is generally catalyzed by Pt catalyst at high temperature to promote the self-polymerization and crosslinking of Si-H and vinyl, and the hydroxyl group can be combined with Si -H reacts and polymerizes quickly at room temperature, so the hydroxyl content in silicone die-bonding adhesives is generally not too high, which leads to poor bonding performance of silicone die-bonding adhesives

On the other hand, the silicone crystal-bonding adhesive is catalyzed and cured at high temperature by a Pt catalyst, which leads to the fact that in general, the Si-H and vinyl crosslinking of the silicone crystal-bonding adhesive is not complete. Catalysts are catalyzed by chelating bonds, so it is inevitable that they cannot catalyze all Si-H and vinyl crosslinks completely and uniformly. If you want to enhance the catalytic performance, you can only increase the amount of Pt catalysts. However, if you increase the content of Pt catalysts, Metal catalysts at high temperatures will induce yellowing of the colloids, so determine the content of Pt catalysts to ensure the catalytic degree of Si-H and vinyl groups of silicone crystal-bonding adhesives and the high-temperature yellowing resistance performance, taking into account the hydroxyl content in the colloids, It is a difficult problem to ensure the high-temperature bonding performance of silicone die-bonding adhesive

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