Testing device for scoring hard brittle material in micro-nano scale and testing method thereof

Abstract

The invention discloses a testing device for scoring a hard brittle material in a micro-nano scale and a testing method thereof. The testing device comprises a clamp for a test piece used for fixing atest sample, a work platform for fixing the clamp for the test piece, an XYZ axis movement mechanism for carrying a scoring tool to move in the XYZ direction, an air flotation platform on which the whole scoring testing device is placed, and leveling bolts with the height can be adjusted accurately which are located below an adjusting platform. The nanometer-precision scoring depth in a Z-axis direction is realized by controlling the movement of a linear displacement table. Material removal and machining mechanisms of brittle materials are researched to realize plastic processing of differentaspect ratio structures by clamping single diamond scoring cutters with different taper angles and arc radiuses to perform scoring. The angle of the sample platform is adjusted through the leveling bolts, so that high precision scoring in a changing cutting depth or an equal depth is realized. The testing device is simple in structure, high in testing precision and convenient to operate.

Description

technical field [0001] The invention belongs to the field of material testing and ultra-precision machining in mechanical processing, and in particular relates to a micro-nano scribing hard and brittle material test device and a test method thereof. Background technique [0002] Over the past two decades, hard and brittle materials such as engineering ceramics and optical glass have been widely used in aerospace, petrochemical, marine, electrical and electronic engineering, and automobile manufacturing because of their unique properties. Engineering ceramics, silicon, and optical glass are typical difficult-to-process materials because they have the characteristics of high hardness, high strength, good wear resistance, and high brittleness. Through grinding and lapping polishing processes, a high grade of surface finish can be obtained with high dimensional and shape accuracy. However, in the process of grinding and grinding, the material removal mechanism and deformation m...

AI Technical Summary

Problems solved by technology

The scoring test of hard and brittle materials is carried out in the nano-scratch instrument, which has high test accuracy, but the marking head is a special pressure head, and it is impossible to explore the impact of the abrasive grain geometry on the marking shape and material during marking. The effect of removal, and it is impossible to perform high-speed scribing, which is not conducive to the realization of controllable, high-aspect-ratio trench array structure processing

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